Multi-phase Heat Dissipating Device for Electronic Thermal Management
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Solution Overview
Problem
Current heat dissipating devices, such as heat spreaders, have limited capabilities in dissipating heat from high-performance electronic components like CPUs and GPUs, particularly in mobile devices, and struggle to maintain an acceptable outer surface temperature while effectively reducing junction temperature.
Innovation Solution
A multi-phase heat dissipating device that utilizes a fluid-based system with an evaporator and condenser, where the fluid evaporates at the heat source, is channeled through an evaporation portion, and then condensed at a larger condenser surface, with a separation wall preventing fluid mixing, allowing for efficient heat transfer without the need for pumps or compressors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a traditional heat spreader is used to dissipate heat from the integrated device, then the device structure is simple, but the heat dissipating capability is limited to about 3 Watts
Solution Approach 1:
The patent employs phase transition of the working fluid (evaporation and condensation) as the core mechanism for heat transfer. The evaporator absorbs heat from the integrated device by evaporating the fluid, and the condenser releases heat to the environment by condensing the vapor, achieving high heat dissipating capability through this phase change process
Solution Approach 2:
The patent uses a closed-loop fluid circulation system where the working fluid continuously circulates between the evaporator, condenser, and collection portion. This hydraulic system enables efficient heat transport without requiring external power sources, resolving the contradiction between high heat dissipation and device simplicity
2Temperature
If heat is dissipated through the back side surface of the mobile device, then the heat spreader can dissipate some heat, but the outer surface temperature becomes unacceptable to users
Solution Approach 1:
The patent segments the heat dissipation process into distinct functional components: evaporator (coupled to heat source), condenser (for heat release), and collection portion (for fluid return). This segmentation allows optimized heat transfer at each stage while controlling surface temperatures
Solution Approach 2:
The working fluid acts as an intermediary medium that transfers heat from the integrated device through the evaporator and condenser to the environment. This intermediary enables efficient heat removal while maintaining acceptable temperatures at the device's outer surfaces
3Power
If a fluid-based heat dissipating device with evaporator and condenser is used, then heat dissipating capability increases to up to 18 Watts, but the device complexity increases
Solution Approach 1:
The patent merges multiple functions into integrated components. The inner wall serves both as a structural boundary and as part of the evaporation/condensation chambers. The collection portion integrates fluid collection and return functions. This merging reduces the number of separate components while maintaining high heat dissipation capability
Solution Approach 2:
The heat dissipating device is designed to be self-contained and self-regulating. The working fluid automatically circulates through phase change and gravity-driven return, eliminating the need for external pumps or control systems. This self-service approach achieves high heat dissipation without proportionally increasing device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the dissipation of significantly more heat than traditional heat spreaders, up to 18 Watts, while maintaining a surface temperature within user-acceptable limits, and does so without the complexity of pumps or compressors, enhancing the thermal management of electronic devices.
Implementation Method 1
an evaporator configured to evaporate the fluid
Implementation Method 2
a condenser configured to condense the fluid
Implementation Method 3
A multi-phase heat dissipating device that utilizes a fluid-based system with an evaporator and condenser
Data Source
Figure 1~3
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Figure 6
AI summary
A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, wherein the evaporation portion is at least partially defined by the inner wall, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator, wherein the collection portion is at least partially defined by the inner wall. The heat dissipating device may be a multi-phase heat dissipating device.