Multi-PIC Package Assembly With Independent Thermal Control

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Solution Overview

Problem

Legacy LiDAR systems for autonomous vehicles face challenges with increased form factor and cost due to external laser components, and lack independent thermal control for multiple photonic integrated circuit (PIC) dies within a package, leading to inefficient thermal management and manufacturing complexities.

Innovation Solution

The development of a package assembly that optically couples multiple PICs with integrated thermal management features, including thermal electric coolers (TECs), heat spreaders, and substrates with low coefficient of thermal expansion materials, allowing for independent thermal control and reduced form factor, thereby enhancing thermal isolation and reducing the need for wire bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If external laser components are used in legacy LiDAR systems, then optical functionality is achieved, but form factor and cost increase

Engineering Contradiction:

Improveform factorVSAvoidmanufacturing complexity

Core Design Contradiction:

Volume of moving objectVSEase of manufacture

Solution Approach 1:

The patent merges multiple discrete components (laser source, modulator, detector, and optical elements) into a single integrated photonic circuit die. This consolidation eliminates the need for external laser components and their associated mounting, alignment, and housing structures, thereby reducing form factor while maintaining manufacturing feasibility through standardized semiconductor fabrication processes

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The photonic integrated circuit die performs multiple functions (laser generation, modulation, optical transmission, and detection) within a single universal platform. This multi-functionality eliminates the need for separate external laser components and their individual mounting structures, reducing overall system form factor and simplifying manufacturing

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Device complexity

If multiple PICs are packaged without independent thermal control, then device complexity is reduced, but thermal management efficiency deteriorates

Engineering Contradiction:

Improvethermal control complexityVSAvoidthermal management efficiency

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The thermal management system is segmented into independent control zones, with each PIC die having its own dedicated TEC device. This segmentation allows independent thermal regulation of each photonic circuit, ensuring optimal performance and reliability without requiring complex centralized thermal control systems

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Each PIC die is equipped with its own localized thermal control mechanism (TEC device) and thermal management structures (heat spreaders, thermal vias). This local quality approach ensures that thermal conditions are optimized specifically for each photonic circuit's requirements, improving overall thermal management efficiency while keeping the control system manageable

Inventive Principle:

Principle #3Local quality

3Volume of moving object

If multiple PICs are optically coupled in close proximity, then form factor is reduced, but thermal isolation between PICs becomes challenging

Engineering Contradiction:

Improvepackage sizeVSAvoidthermal isolation

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

Thermal isolation structures (such as thermal barriers, low-conductivity materials, or air gaps) are introduced as intermediary elements between adjacent PIC dies. These intermediaries allow the PICs to be positioned in close proximity for compact packaging while simultaneously preventing thermal crosstalk, maintaining thermal isolation despite reduced package size

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs a hierarchical nesting approach where individual thermal management structures (TEC devices, heat spreaders, thermal vias) are nested within each PIC package, and these nested units are then arranged in a compact configuration. This nesting allows tight spacing between PICs while maintaining independent thermal zones through the nested thermal management structures

Inventive Principle:

Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables efficient thermal management of multiple PICs within a constrained space, reducing the form factor and cost of LiDAR systems while improving thermal isolation and electrical performance, facilitating the integration of more sensors in autonomous vehicles.

Implementation Method 1

thermal electric coolers (TECs)

Methodology Applied

Scientific EffectPeltier Effect: Peltier Effect

Implementation Method 2

heat spreaders

Methodology Applied

Scientific EffectThermal Conduction: Conduction (thermal)

Data Source

PatentUS20230318247A1Package with multiple photonic integrated circuit dies optically coupled with each other

Publication Date: 2023.10.05 INTEL CORP

AI summary

Embodiments herein relate to systems, apparatuses, or processes directed to a package that includes multiple PICs in the package that are optically coupled with each other. In embodiments, the package may include discrete electronic and optical components, and thermal management solutions for co-packaging of multiple PICs. Other embodiments may be described and/or claimed.