Multi-piece Shield with Thermal Insert for Circuit Boards

Solution Overview

Problem

Existing shielding solutions for circuitry on circuit boards either lack reworkability and testing capabilities due to higher costs or are impractical for thin devices, and they do not effectively combine electromagnetic shielding with thermal management.

Innovation Solution

A multi-piece shield comprising a fence, a lid, and an insert, where the insert is made of a material with higher thermal conductivity or greater thickness than the lid, providing enhanced shielding and heat absorption while allowing for cost-effective and reworkable designs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a one-piece shield is used, then manufacturing cost is reduced and structure is simplified, but reworkability and testing capabilities are lost

Engineering Contradiction:

Improvemanufacturing costVSAvoidreworkability

Core Design Contradiction:

Ease of manufactureVSEase of repair

Solution Approach 1:

The shield is divided into multiple separate pieces (fence, lid, insert) that can be individually manufactured and assembled. This segmentation allows each component to be produced cost-effectively while enabling selective disassembly for reworkability and testing, resolving the contradiction between manufacturing simplicity and repairability.

Inventive Principle:

Principle #1Segmentation

2Ease of repair

If a two-piece shield is used, then reworkability and testing are improved, but manufacturing cost increases

Engineering Contradiction:

ImprovereworkabilityVSAvoidmanufacturing cost

Core Design Contradiction:

Ease of repairVSEase of manufacture

Solution Approach 1:

The shield is divided into multiple separate pieces (fence, lid, insert) that can be individually manufactured and assembled. This segmentation allows each component to be produced cost-effectively while enabling selective disassembly for reworkability and testing, resolving the contradiction between manufacturing simplicity and repairability.

Inventive Principle:

Principle #1Segmentation

3Object-affected harmful factors

If shielding thickness is increased, then electromagnetic shielding effectiveness is improved, but weight increases

Engineering Contradiction:

Improveshielding effectivenessVSAvoidshield weight

Core Design Contradiction:

Object-affected harmful factorsVSWeight of moving object

Solution Approach 1:

The shield uses composite construction with different materials optimized for specific functions: conductive materials for electromagnetic shielding and high thermal conductivity materials for heat dissipation. This allows achieving effective shielding without uniformly increasing thickness throughout the entire structure, thereby controlling weight.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The insert is positioned specifically over heat-generating circuitry where both shielding and thermal management are most needed. This localized approach provides enhanced shielding effectiveness at critical areas without unnecessarily increasing weight across the entire shield structure.

Inventive Principle:

Principle #3Local quality

4Temperature

If thermal conductivity is increased, then heat dissipation is improved, but material selection becomes more limited

Engineering Contradiction:

Improveheat dissipationVSAvoidmaterial selection

Core Design Contradiction:

TemperatureVSAdaptability or versatility

Solution Approach 1:

The shield uses composite construction with different materials optimized for specific functions: conductive materials for electromagnetic shielding and high thermal conductivity materials for heat dissipation. This allows achieving effective shielding without uniformly increasing thickness throughout the entire structure, thereby controlling weight.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The insert is positioned specifically over heat-generating circuitry where both shielding and thermal management are most needed. This localized approach provides enhanced shielding effectiveness at critical areas without unnecessarily increasing weight across the entire shield structure.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The multi-piece shield effectively shields circuitry from electromagnetic radiation and dissipates heat, offering improved thermal benefits and cost-effectiveness while maintaining reworkability and reduced weight.

Implementation Method 1

The insert could be made of a material having a higher thermal conductivity to further facilitate heat absorption

Methodology Applied

Scientific EffectThermal conductivity: Conduction (thermal)

Implementation Method 2

shielding elements are used in electrical circuits to protect specific components of the circuit from electromagnetic radiation

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS10238017B2Multi-piece shield

Publication Date: 2019.03.19 AK STAMPING CO INC

AI summary

This disclosure relates to a multi-piece shield comprising a fence, a lid, and an insert. The lid attaches to the fence, which is attached to the circuit board. The lid is a relatively thick, flexible material for supporting the insert. The lid has a recess so that the insert can be recessed into the lid to position the insert closer to the circuit for enhanced heat absorption. The insert is made of a thicker heat absorbing material than the lid, again to facilitate heat absorption. The insert can be press-fit into the recess of the lid. The lid can have a dovetail configuration to retain the insert in the lid.