Multi-Pin Adhesive Transfer for Die Bonding
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Solution Overview
Problem
Existing adhesive dispensing systems for die-bonding in electronics require frequent machine idle time and increased costs due to the need for replacing or cleaning stamping pins and adhesive discs when switching between different adhesives, limiting flexibility and efficiency in handling multiple types of dice with varying adhesive requirements.
Innovation Solution
A stamping system with multiple containers for different adhesives and corresponding stamping pins that allow for sequential transfer of various adhesives onto a substrate without the need for physical replacement or cleaning, enabling efficient handling of multiple adhesive types on a single die bonder.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single stamping pin and adhesive disc are used for different adhesives, then equipment cost is reduced, but machine idle time increases due to cleaning and replacement operations
Solution Approach 1:
The system divides the adhesive dispensing function into multiple independent stamping pins, each dedicated to a specific adhesive type. This segmentation allows simultaneous access to multiple adhesives without requiring cleaning or replacement operations, resolving the contradiction between equipment simplicity and operational continuity.
Solution Approach 2:
The system creates a multi-functional adhesive dispensing mechanism where multiple stamping pins collectively handle different adhesive types. Each pin is specialized for one adhesive, but the system as a whole achieves universality by supporting multiple adhesive types simultaneously, eliminating idle time while maintaining cost efficiency.
2Loss of time
If multiple stamping pins for different adhesives are used, then machine idle time is reduced, but device complexity and cost increase
Solution Approach 1:
The system segments the adhesive handling function into dedicated stamping pins for each adhesive type. This segmentation eliminates the need for cleaning and replacement operations, reducing machine idle time while keeping each individual pin simple in design.
Solution Approach 2:
Instead of cleaning and reusing a single stamping pin, the system effectively discards the limitation of single-use pins by implementing multiple disposable-style pins that can be independently used for different adhesives, eliminating cleaning time while maintaining operational efficiency.
3Productivity
If dedicated machines are used for each adhesive type, then adhesive handling efficiency is improved, but manufacturing cost increases
Solution Approach 1:
The system merges multiple adhesive handling capabilities into a single die bonder by incorporating multiple stamping pins. This consolidation achieves the productivity of dedicated machines while avoiding the cost of multiple separate equipment units.
Solution Approach 2:
A single die bonder is transformed into a multi-functional system capable of handling multiple adhesive types simultaneously through the implementation of multiple specialized stamping pins, achieving dedicated machine efficiency without dedicated machine costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces machine idle time and costs by allowing for the simultaneous use of multiple adhesives on a single die bonder, enhancing flexibility and efficiency in high-volume die bonding processes without the need for dedicated machines for each adhesive type.
Implementation Method 1
transferring the first adhesive with the first stamping pin from the first container to the substrate
Data Source
AI summary
Multiple types of adhesives contained in separate containers are transferred from a supply of adhesives to a substrate. A first stamping pin is moved to a position of a first container containing a first adhesive, and the first adhesive is transferred with the first stamping pin from the first container to the substrate before bonding a first die onto the first adhesive. A second stamping pin is then moved to a position of a second container containing a second adhesive, and the second adhesive is transferred with the second stamping pin from the second container to the substrate before bonding a second die onto the second adhesive.