Multi-Pin Coating Head for Faster Board Mounting Application

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Solution Overview

Problem

Existing electronic component mounting methods, such as those described in Patent Literature 1, do not optimize the number of nozzle immersions in cream solder and transfers, leading to increased required time for applying a coating agent to multiple mounting portions on a board.

Innovation Solution

A coating device and component mounting machine that includes a container for the coating agent, a driving device to move and lift a pin member, and a control section to control the dipping process, allowing for efficient application of the coating agent to multiple mounting portions on a board by optimizing the number of dips and positions for the pin member.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the nozzle is immersed in cream solder and transferred to one mounting portion repeatedly, then the coating agent can be applied to each mounting portion, but the total time required increases significantly

Engineering Contradiction:

Improvecoating application accuracyVSAvoidtotal coating time

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The pin member is divided into multiple pin protrusions (first, second, third pin protrusions) that can simultaneously contact multiple mounting portions. This segmentation allows parallel coating application to multiple locations, reducing the total time required while maintaining precise coating application at each location.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Multiple coating operations that were previously performed sequentially are merged into a single simultaneous operation. The pin member with multiple pin protrusions applies coating agent to multiple mounting portions at the same time, combining several steps into one efficient action.

Inventive Principle:

Principle #5Merging (Combining)

2Quantity of substance

If the nozzle is immersed in cream solder multiple times for multiple mounting portions, then all portions can be coated, but the number of immersions increases the process time

Engineering Contradiction:

Improvenumber of mounting portions coatedVSAvoiddipping and transferring duration

Core Design Contradiction:

Quantity of substanceVSDuration of action of moving object

Solution Approach 1:

The pin member is segmented into multiple pin protrusions that can simultaneously engage multiple mounting portions. This allows the system to coat a larger quantity of mounting portions in a single dipping action, reducing the number of times the pin member needs to be immersed in the coating agent.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The pin member maintains continuous contact with multiple mounting portions simultaneously during the coating process. By having multiple pin protrusions engage multiple mounting portions at once, the useful action of coating continues across multiple locations without interruption or repeated dipping cycles.

Inventive Principle:

Principle #20Continuity of useful action

Data Source

PatentUS12262480B2Coating device and component mounting machine

Publication Date: 2025.03.25 FUJI CORP

AI summary

A coating device includes a container, a driving device, and a control section. The container accommodates a liquid coating agent to be applied to multiple mounting portions of a board on which a component is to be mounted. The driving device horizontally moves and lifts and lowers a pin member between the container and the positioned board. The control section drives and controls the driving device to dip the pin member in the coating agent to apply the coating agent to each of the multiple mounting portions using the coating agent held by a distal end portion of the pin member.