Multi-pin Connector Array for Modular Device Data Exchange
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Solution Overview
Problem
Existing modular portable device systems face challenges in efficiently interconnecting devices with varying data speeds and functionalities, lacking a standardized method for reliable data exchange and power management between base devices and module devices.
Innovation Solution
A modular device system with a multi-pin connector array that supports multiple data speeds, incorporating out-of-band hardware RFR for SPI and in-band ACK/NACK, allowing for electrical connection and data exchange between a base portable electronic communication device and module devices, enabling various functionalities such as SPI communications, USB2.0, and display capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a multi-pin connector array is used to support multiple data speeds, then adaptability and data exchange capability are improved, but device complexity increases
Solution Approach 1:
The connector array is segmented into multiple independent pins, each capable of operating at different data speeds. This allows the system to support multiple data speeds simultaneously without requiring a completely different connector for each speed, thereby improving adaptability while managing complexity through modular pin-level segmentation.
Solution Approach 2:
The multi-pin connector array is designed to perform multiple functions by supporting different data speeds (low speed and high speed) on different pins or combinations of pins. This universal connector design eliminates the need for separate connectors for different data speeds, improving versatility while containing complexity within a single standardized interface.
2Reliability
If out-of-band hardware RFR for SPI is implemented, then reliability of data exchange is improved, but device complexity increases
Solution Approach 1:
The out-of-band hardware RFR (Request for Repeat) mechanism acts as an intermediary error correction layer for SPI communications. This separate hardware layer handles reliability concerns independently from the main data path, improving data exchange reliability while containing complexity in a dedicated error handling subsystem rather than complicating the entire communication protocol.
Solution Approach 2:
The hardware RFR mechanism implements feedback by detecting communication errors and automatically requesting retransmission of affected data. This feedback loop improves reliability by ensuring accurate data exchange, while the automated nature of the feedback mechanism prevents significant increases in protocol complexity.
3Reliability
If in-band ACK/NACK for SPI is implemented, then reliability of data exchange is improved, but use of energy increases
Solution Approach 1:
The in-band ACK/NACK mechanism uses periodic acknowledgment signals to confirm successful data reception. By implementing this as a standardized periodic communication pattern rather than continuous verification, the system achieves improved reliability through regular status checks while limiting energy consumption by not requiring constant verification signaling.
Data Source
AI summary
A modular device system includes a base portable electronic communication device and an add-on module. A multi-pin connector array on the base portable electronic communication device includes multiple connectors supporting one or more data speeds and other functionality. The array is configured and located to electrically connect to a mating array on the add-on module when the add-on module is mated to the base portable electronic communication device.