Multi-Pipe Converter Housing for Efficient External Heat Dissipation

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Solution Overview

Problem

Existing converters face inefficiencies in heat dissipation, which can lead to increased temperatures and reduced performance of electronic components.

Innovation Solution

The converter design incorporates a housing with integrated first and second pipes forming a refrigerant path, along with a heat dissipation plate to enhance heat transfer and dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a single refrigerant pipe is used for heat dissipation, then the structure is simple, but heat dissipation efficiency is insufficient

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidpipe structure complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The refrigerant pipe is divided into multiple parallel pipes (first refrigerant pipe and second refrigerant pipe) that are spaced apart from each other. This segmentation increases the surface area for heat dissipation and improves thermal efficiency without creating a overly complex structure, as the parallel arrangement maintains simplicity while enhancing performance.

Inventive Principle:
Principle #1Segmentation

2Adaptability or versatility

If multiple electronic components are disposed in the housing, then functionality is enhanced, but heat generation increases and heat dissipation becomes more difficult

Engineering Contradiction:
Improveelectronic component integrationVSAvoidheat dissipation efficiency
Core Design Contradiction:
Adaptability or versatilityVSTemperature

Solution Approach 1:

The patent utilizes three-dimensional spatial arrangement by disposing multiple electronic components (DC-DC converter, OBC, PDU) vertically within the housing and positioning the parallel refrigerant pipes to contact different surfaces of the housing. This dimensional approach allows efficient heat dissipation from multiple heat-generating components without increasing horizontal footprint.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Temperature

If the refrigerant pipe is disposed inside the housing, then heat dissipation is achieved, but the pipe occupies valuable internal space

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidinternal space utilization
Core Design Contradiction:
TemperatureVSVolume of stationary object

Solution Approach 1:

The refrigerant pipes are extracted from the internal housing space and positioned on the external outer surfaces of the housing. This extraction allows the pipes to dissipate heat from the housing itself without occupying valuable internal space needed for electronic components, while still achieving effective heat dissipation through contact with the housing surfaces.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design simplifies manufacturing, reduces part counts, and lowers production costs while improving heat dissipation efficiency, thereby maintaining the performance and reliability of electronic components.

Implementation Method 1

a refrigerant pipe or a refrigerant passage for absorbing heat generated from the electronic component is disposed in the housing

Methodology Applied
Scientific EffectHeat absorption: Absorption (physical)

Implementation Method 2

For heat dissipation, a refrigerant pipe or a refrigerant passage for absorbing heat generated from the electronic component is disposed in the housing

Methodology Applied
Scientific EffectHeat dissipation: Convection

Data Source

PatentUS20250030336A1Multi-pipe converter
Publication Date: 2025.01.23 LG INNOTEK CO LTD
  • US20250030336A1 patent drawing
  • US20250030336A1 patent drawing
  • US20250030336A1 patent drawing

AI summary

A converter including a housing including an inner space, electronic components disposed in the inner space, a first pipe disposed on the outer surface of the housing and including a first-first pipe and a first-second pipe arranged in parallel to and spaced apart from each other, and a second pipe coupled at both ends thereof to the first-first pipe and the first-second pipe, respectively.