Multi-Pixel Array Sensor Chip for Compact Camera Systems
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Solution Overview
Problem
Conventional optical camera systems using multiple single-array image sensor chips are complex, bulky, and costly due to duplicated signal chains and alignment challenges, leading to high power consumption and increased size.
Innovation Solution
A camera system with multiple pixel arrays integrated on a single semiconductor substrate, allowing for compact design and shared signal processing, reducing the need for multiple chips and simplifying alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple single-array image sensor chips are used to capture multiple images, then multiple images can be captured, but the system becomes complex and bulky due to duplicated signal chains and alignment challenges
Solution Approach 1:
The patent combines multiple pixel arrays onto a single image sensor chip, merging what were previously separate sensor chips into one integrated device. This eliminates the need for multiple independent signal chains and reduces alignment complexity while maintaining the capability to capture multiple images simultaneously
Solution Approach 2:
The single image sensor chip is designed to perform multiple functions by integrating multiple pixel arrays that can capture different images or image portions simultaneously, making the chip a multi-functional device that replaces multiple single-function chips
2Adaptability or versatility
If multiple single-array image sensor chips are used, then multiple images can be captured, but power consumption increases due to duplicated signal chains
Solution Approach 1:
By merging multiple pixel arrays onto a single chip with a shared signal chain, the patent eliminates redundant signal processing circuits that would otherwise be present on multiple separate chips, thereby reducing overall power consumption while maintaining multiple image capture capability
3Adaptability or versatility
If multiple single-array image sensor chips are used, then multiple images can be captured, but manufacturing cost increases due to alignment challenges
Solution Approach 1:
The patent merges multiple pixel arrays into a single chip structure that is manufactured as one integrated unit, eliminating the post-manufacturing alignment process required when assembling multiple separate chips, thereby simplifying manufacturing and reducing costs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a more compact, cost-effective, and power-efficient camera system capable of capturing multiple images with reduced manufacturing complexity and cost, while maintaining high image quality.
Implementation Method 1
each pixel provides an electrical output corresponding to the intensity of the incident light to which the pixel is exposed
Data Source
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AI summary
A camera system uses one or more image sensor IC chips each having multiple pixel arrays on the same semiconductor substrate (i.e., "multiple pixel arrays on a chip"). In one embodiment, such a camera system includes: (a) optical components that create multiple images in dose physical proximity of each other (e.g., within a few millimeters or 10 centimeters); and (b) a single sensor substrate ("chip") containing multiple 2 -dimensional pixel arrays that are aligned to capture these multiple images, so as to convert the multiple images into electrical signal. The pixel arrays can be manufactured using a CCD or a CMOS compatible process. Such a chip is typically two centimeters or less on a side. Optional electronic components for further signal processing of the captured images may be formed either on the sensor chip (i.e., in a "system-on-a-chip" implementation), or in a separate back-end application specific integrated circuit (ASIC).