Multi-Planar Circuit Board Z-Height Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in semiconductor technology is to reduce the z-height of circuit boards in portable devices without compromising signal integrity, as existing methods either limit the number of layers or increase the overall thickness, making it difficult to accommodate taller components within the same form factor.
Innovation Solution
A multi-planar circuit board design is implemented, where sections of the board are arranged in different planes with gradient connections, allowing components to be mounted on both sides without increasing the overall thickness, by calculating the minimum z-height based on the tallest component and adding the circuit board thickness, thereby optimizing surface component connections and reducing overall z-height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If components are mounted on both sides of the circuit board to increase functionality, then the number of components is improved, but the overall z-height increases
Solution Approach 1:
The patent applies multi-planar design where the circuit board transitions from a single plane to multiple planes (first plane, second plane, third plane) with gradient sections connecting them. This allows components to be mounted on both sides of the board while maintaining a controlled z-height by distributing components across different vertical levels rather than stacking them uniformly.
Solution Approach 2:
The circuit board is segmented into multiple planar sections (first section, second section, third section) with different z-heights connected by gradient sections. This segmentation allows different regions of the board to operate at different vertical levels, enabling bidirectional component mounting without uniformly increasing the overall thickness.
2Quantity of substance
If the number of layers is increased to accommodate more components, then the component capacity is improved, but the manufacturing complexity increases
Solution Approach 1:
Instead of increasing the number of traditional PCB layers, the patent uses a multi-planar approach where the board surface itself is divided into multiple planes at different z-heights. This dimensional change allows more components to be accommodated without proportionally increasing manufacturing complexity, as the planes are connected through gradient sections rather than requiring complex multi-layer stacking.
3Length of stationary object
If the z-height is reduced to fit portable devices, then the form factor is improved, but the signal integrity may deteriorate
Solution Approach 1:
The patent applies local quality by creating gradient sections that provide smooth, gradual transitions between different z-heights rather than abrupt changes. This gradual transition maintains consistent signal characteristics across the board by avoiding sudden impedance changes, while still achieving reduced overall z-height for portable device applications.
Data Source
AI summary
Disclosed herein is a multi-planar circuit board, as well as related structures and methods. In an embodiment, a circuit board may include a first surface, a first section having the first surface in a first plane, a second section having the first surface in a second plane, and a third section connecting the first and second sections, where the third section defines a gradient between the first and second planes, and where all sections are sections within a contiguous board. In another embodiment, circuit board may further include a first component having a first thickness coupled on the first face of the first section, and a second component having a second thickness, greater than the first component, coupled on the first face of the second section, where the second section is in a lower plane, and where the overall thickness is the circuit board thickness plus the second thickness.