Multi-Planar Paddle with Uplift Rim for IC Package
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Solution Overview
Problem
Current integrated circuit package systems face challenges with large die applications, bond wires, lead spacing, structural integrity, and die attach options, particularly in achieving flexible solutions for smaller form factors and lower costs.
Innovation Solution
The implementation of a multi-planar paddle with an uplift rim that supports the integrated circuit, providing a top rim surface for attachment and preventing shorting, while also offering an open or closed pad design and multiple lead rows for improved structural integrity and connector efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a traditional single-plane paddle is used for die attachment, then the structure is simple, but it cannot provide sufficient support for large die applications and has limited flexibility for different die sizes
Solution Approach 1:
The paddle structure transitions from a single-plane configuration to a multi-planar configuration with an uplift rim that creates a second plane. This dimensional change allows the paddle to accommodate different die sizes and shapes while providing enhanced support structures for various attachment methods, thereby increasing adaptability without proportionally increasing complexity.
Solution Approach 2:
The paddle is segmented into distinct functional regions: a base plane for structural support and lead attachment, and an uplift rim creating a top plane for die attachment. This segmentation allows each plane to be optimized for its specific function while maintaining overall structural integrity, enabling versatility across different die applications.
2Reliability
If the integrated circuit is attached directly to a flat paddle surface, then the attachment process is simple, but short circuits can occur between the die and leads
Solution Approach 1:
The uplift rim creates a vertical separation between the die attachment surface and the lead plane, establishing a third-dimensional barrier that physically prevents short circuits. This dimensional elevation ensures that even with large die sizes, electrical isolation is maintained without requiring additional complex insulating structures.
3Adaptability or versatility
If more leads are added to accommodate larger dies, then larger die applications are supported, but lead spacing and connector efficiency deteriorate
Solution Approach 1:
The multi-planar paddle segments the lead arrangement into organized rows that can be independently optimized. Leads are distributed across multiple planes and rows, allowing for efficient routing and reduced spacing requirements. This segmentation enables better connector efficiency while supporting larger die applications through improved lead organization and access.
Data Source
AI summary
An integrated circuit package system includes a multi-planar paddle having an uplift rim and an attached integrated circuit over the uplift rim of the multi-planar paddle.