Multi-Plane Leadframe for Dual-Side Semiconductor Cooling
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Solution Overview
Problem
Semiconductor packages face challenges in effectively cooling power semiconductor dies due to limited heat dissipation methods, particularly in maintaining efficient thermal management across both sides of the package.
Innovation Solution
A leadframe design with multiple die pads and contact pads arranged in distinct planes allows for dual-side cooling, where the upper surface of one die pad and the lower surface of another form part of the outer package surface, enabling heat dissipation from both sides during the molding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional leadframe with single-plane die pads is used, then the manufacturing process is simple, but heat dissipation from both sides of the package is not achieved
Solution Approach 1:
The leadframe structure transitions from a conventional single-plane configuration to a multi-plane three-dimensional arrangement. Specifically, the leadframe includes a first die pad in a first plane and a second die pad in a second plane that is offset from the first plane, creating dual-side cooling surfaces that enable heat dissipation from both the top and bottom of the semiconductor package.
Solution Approach 2:
The leadframe is segmented into multiple functional components arranged in different planes: a first die pad for mounting a first semiconductor die, a second die pad for mounting a second semiconductor die, and contact pads for electrical connections. This segmentation allows each component to serve its specific function while collectively achieving dual-side thermal management.
2Reliability
If dual-side cooling is implemented with multiple die pads in different planes, then thermal management is improved, but the leadframe structure becomes more complex
Solution Approach 1:
The leadframe structure serves multiple functions simultaneously: it provides mechanical support for semiconductor dies, establishes electrical connections through contact pads, and enables thermal management from both sides of the package. The multi-plane configuration of die pads allows the same leadframe structure to fulfill both electrical and thermal management roles efficiently.
3Temperature
If additional manufacturing steps are added to achieve dual-side cooling, then heat dissipation improves, but manufacturing complexity and cost increase
Solution Approach 1:
The dual-side cooling capability is built into the leadframe structure during its initial formation, before the semiconductor packaging process begins. The multi-plane die pad configuration is pre-established in the leadframe design, so that when molding compound is applied and semiconductor dies are mounted, dual-side cooling is automatically achieved without requiring additional post-processing steps or specialized molding techniques.
Data Source
AI summary
A leadframe, that is to be incorporated into a semiconductor housing is provided. The leadframe may include a first die pad, a second die pad and a plurality of contact pads. A lower surface of the contact pads and a lower surface of the first die pad are arranged in a first plane. An upper surface of the second die pad is arranged in a second plane distant from the first plane by an overall thickness of the semiconductor package.