Multi-Plane Signal Couplers for Concurrent Power Wave Measurement
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Solution Overview
Problem
Existing electronic devices struggle to concurrently measure signal characteristics at multiple reference planes along a signal path due to the impracticality of sequential measurements in dynamic environments, which hinders real-time performance characterization and adjustment.
Innovation Solution
Implementing multi-coupler circuitry with multiple signal couplers distributed across metallization layers on a stacked dielectric substrate to enable concurrent measurement of signal characteristics at different reference planes, allowing for dynamic adjustment of impedance terminations to maximize isolation and improve measurement accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If sequential measurements are used to measure signal characteristics at multiple reference planes, then device complexity is reduced, but measurement time increases and real-time performance characterization is hindered
Solution Approach 1:
The patent combines multiple signal couplers into a single multi-coupler device that can concurrently measure multiple reference planes. Multiple coupler functions are merged into one integrated structure with multiple coupling nodes, allowing simultaneous measurement of forward and reverse waves at different reference planes without requiring separate measurement devices for each plane.
Solution Approach 2:
The multi-coupler is segmented into multiple independent coupling nodes, each with its own signal coupler configured for a specific reference plane. Each node can operate independently to measure signal characteristics at its designated reference plane, enabling concurrent measurements across multiple segments of the signal path without interference.
2Measurement precision
If multiple signal couplers are used to measure multiple reference planes concurrently, then measurement accuracy improves, but device complexity increases
Solution Approach 1:
The multi-coupler device performs multiple measurement functions simultaneously through a single integrated structure. It can measure forward waves, reverse waves, impedances, and delivered powers at multiple reference planes concurrently, providing universal measurement capability that replaces what would otherwise require multiple separate measurement systems.
Solution Approach 2:
The patent introduces an intermediary multi-coupler structure that mediates between the signal source and multiple reference planes. This intermediary device provides isolated coupling nodes that can independently measure signal characteristics at different reference planes without directly interfering with each other's measurements, thereby maintaining measurement accuracy.
3Area of stationary object
If signal couplers are placed close together to save space, then area is reduced, but isolation between couplers decreases affecting measurement accuracy
Solution Approach 1:
The patent transitions from a planar layout to a three-dimensional stacked architecture where multiple coupling nodes are arranged in vertical layers separated by dielectric substrates. This dimensional change allows signal couplers to be placed in close proximity horizontally while maintaining adequate isolation vertically through the dielectric layers, effectively resolving the space versus isolation trade-off.
Solution Approach 2:
The multi-coupler structure implements a nested arrangement where multiple coupling nodes are embedded within a single integrated device footprint. Each coupling node is nested within its own isolated measurement path, allowing compact packaging while maintaining the functional independence and isolation required for accurate concurrent measurements at multiple reference planes.
Data Source
AI summary
An electronic device may include signal transmission circuitry having a signal path and a signal source that transmits a signal on the signal path. First and second signal couplers may be coupled to the signal path. Control circuitry may use the first signal coupler to measure the signal at a first reference plane and may use the second signal coupler to concurrently measure the signal at a second reference plane. The signal measurements may include power wave, forward wave, reverse wave, impedance, and/or delivered power measurements. Terminations in the signal couplers may be adjusted to dynamically shift the reference planes. The first and second signal couplers may be formed from first and third metallization layers on a stacked dielectric substrate, where the signal path is formed from a second metallization layer. Additional signal couplers may be coupled to the signal path for concurrently measuring additional reference planes.