Multi-Plane VRM Layout for High Power and Heat Dissipation
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Solution Overview
Problem
Designing a Voltage Regulator Module (VRM) that efficiently converts high power at low voltages for Integrated Circuits (ICs) is challenging due to space constraints and the need to dissipate heat effectively, while maintaining a compact footprint.
Innovation Solution
The high-power VRM employs multiple circuit boards oriented in different planes to minimize space and enhance heat dissipation, with capacitors and inductors configured to filter various frequency components, and includes a cooling system to manage heat generated by components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If VRM components are located in close proximity to achieve high power density, then power output is improved, but space constraints and heat dissipation difficulty worsen
Solution Approach 1:
The patent transitions from a traditional planar layout to a three-dimensional stacked configuration with circuit boards oriented in different planes (horizontal and vertical orientations). This dimensional change allows components to be distributed in multiple spatial dimensions, reducing thermal density in any single plane while maintaining high overall power density, thus resolving the contradiction between power output and heat dissipation
2Area of moving object
If VRM components are located in close proximity to achieve compact footprint, then area is improved, but component placement and heat dissipation worsen
Solution Approach 1:
The patent divides the VRM into multiple independent circuit boards (first and second voltage rail circuit boards, first and second capacitor circuit boards) that can be manufactured separately and then assembled in a stacked configuration. This segmentation allows each board to be manufactured with standard component placement processes, avoiding the manufacturing difficulties that would arise from placing all components in close proximity on a single board, while achieving a compact overall footprint
3Temperature
If circuit boards are oriented in different planes, then heat dissipation is improved, but device complexity worsens
Solution Approach 1:
The patent employs standardized circuit board designs with universal mounting patterns and connection interfaces that can be manufactured using standard PCB processes. The multi-plane configuration reuses the same board types and component arrangements across different orientations, allowing the complexity of three-dimensional heat dissipation to be achieved through replicated standard units rather than custom complex designs, thus managing device complexity while improving heat dissipation
Data Source
AI summary
A Voltage Regulator Module (VRM) includes a first voltage rail circuit board oriented in a first plane having formed therein a first plurality of conductors and configured to produce a first rail voltage, a second voltage rail circuit board oriented in a second plane that is substantially parallel to the first plane having formed therein a second plurality of conductors and configured to produce a second rail voltage. The VRM also includes a first capacitor circuit board oriented in a third plane that is substantially perpendicular to the first plane and a second capacitor circuit board oriented in a fourth plane that is substantially parallel to the third plane. The VRM includes a plurality of conductors intercoupling the first voltage rail circuit board, the first capacitor circuit board, the second voltage rail circuit board, and the second capacitor circuit board.