Multi-plate Semiconductor Wafer Testing System with Alignment and Pressure Control
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Solution Overview
Problem
Traditional wafer probe cells are cumbersome and difficult to debug due to their enclosed design, making it challenging to identify and access defective components such as pins, which can lead to misalignment and failure during IC testing.
Innovation Solution
A semiconductor wafer testing system comprising a pair of mating plates with alignment features, biasing members, and stoppers that allow for precise alignment and controlled pressure contact between a sectioned test wafer and pins, enabling direct access to components for debugging without the need for a traditional wafer prober.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a traditional enclosed wafer probe cell design is used, then IC testing can be performed, but debugging becomes difficult and access to defective components is restricted
Solution Approach 1:
The system divides the wafer testing apparatus into separate modular plates (first plate with pins, second plate for wafer support) that can be independently accessed and manipulated. This segmentation allows technicians to access defective components without navigating a complex enclosed structure, directly improving ease of operation while maintaining functional integration through precise alignment features.
2Measurement precision
If alignment features are implemented to ensure precise pin-to-wafer alignment, then testing accuracy improves, but the device structure becomes more complex
Solution Approach 1:
The alignment features (alignment holes, alignment pins, and alignment marks) are integrated directly into the plate structures rather than being separate components. This merging approach achieves precise pin-to-wafer alignment through the inherent geometry of the plates themselves, improving measurement precision without significantly increasing overall device complexity.
3Reliability
If biasing members and stoppers are used to regulate contact pressure, then testing reliability improves, but the device structure becomes more complex
Solution Approach 1:
The biasing members (springs) and stoppers are designed to automatically regulate contact pressure through their mechanical interaction during plate assembly. When the plates are brought together, the springs compress until stopped by the stoppers, self-regulating the pressure without requiring external control systems. This self-service mechanism improves reliability while minimizing additional structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates easy identification and correction of defective components, reducing the complexity of debugging and improving the reliability of wafer testing by providing a non-enclosed structure for physical access to potential failure points, thus enhancing the accuracy and efficiency of IC testing.
Implementation Method 1
a biasing member, positioned on the first plate, configured to resist a wafer pressed toward the biasing member by the second plate
Implementation Method 2
The first and second alignment features are configured to align the pins with a test wafer positioned between the first and second plates
Data Source
AI summary
In some embodiments, a semiconductor wafer testing system comprises a first plate configured to couple to a probe head, the first plate including a first alignment feature, a biasing member, a stopper, and pins. The system also comprises a second plate configured to fasten to the first plate and including a second alignment feature configured to engage with the first alignment feature. The first and second alignment features are configured to align the pins with a test wafer positioned between the first and second plates. The biasing member and the stopper are configured to cooperate to regulate a pressure with which the test wafer contacts the pins when the second plate is fastened to the first plate.