Multi-Port Component Cleaning Flow for Semiconductor Valves and Filters
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Solution Overview
Problem
Existing semiconductor device manufacturing processes face challenges in effectively removing foreign substances from components such as valves and filters, which are critical for maintaining the integrity of the manufacturing process.
Innovation Solution
An apparatus and method for cleaning components, including a cleaning fluid supply source, a supply line, a discharge line, and a circulation line, which allows for sequential passage of cleaning fluid through multiple ports of a component, including a three-way valve and a filter, to effectively remove foreign substances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a regular cleaning method is used for components, then the cleaning process is simple, but foreign substances inside the component cannot be effectively removed
Solution Approach 1:
The cleaning apparatus segments the cleaning process into multiple independent flow paths (supply line, discharge line, circulation line) that can be controlled separately. Each line connects to different ports of the component, allowing targeted cleaning of different internal regions through sequential fluid passage.
Solution Approach 2:
The system dynamically controls the cleaning fluid flow direction and path using valves to switch between discharge and circulation modes. The controller adjusts the flow sequence to pass cleaning fluid through multiple ports in a predetermined order, adapting the cleaning process to the specific component geometry and contamination patterns.
2Productivity
If components are cleaned individually, then the cleaning process is simple, but productivity is reduced
Solution Approach 1:
The cleaning apparatus is designed as a universal system that can clean multiple different component types (valves, filters, etc.) with different numbers of ports through a single integrated setup. The supply line, discharge line, and circulation line can be configured to accommodate various component geometries, allowing different components to be cleaned in sequence without requiring separate cleaning equipment for each type.
Solution Approach 2:
The system merges multiple cleaning functions into a single apparatus by combining individual cleaning cycles for different components. The controller coordinates the valve operations to sequentially direct cleaning fluid through different component ports, effectively combining what would traditionally require separate cleaning operations into one continuous process.
3Reliability
If cleaning fluid flows through all ports simultaneously, then cleaning coverage is maximized, but fluid consumption increases
Solution Approach 1:
The cleaning process uses periodic action by sequentially directing cleaning fluid through different ports in a predetermined order rather than simultaneously. The controller operates valves to create a time-based sequence where fluid flows through the first port, then the second port, then the third port, and repeats the cycle. This periodic flow pattern ensures complete cleaning coverage while allowing the same cleaning fluid to be reused across multiple ports, reducing overall consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution enables simultaneous and effective removal of foreign substances from different types of components, improving the cleanliness and reliability of semiconductor device manufacturing processes.
Implementation Method 1
cleaning fluid supplied from the supply line passes sequentially through the first port, the second port, the discharge line, the circulation line, the third port, the second port, and the discharge line
Data Source
AI summary
Disclosed is an apparatus for cleaning a component, the apparatus including: a cleaning fluid supply source; a supply line for receiving cleaning fluid from the cleaning fluid supply source and connected with a first port of the component; a discharge line connected with a second port of the component; and a circulation line branched from the discharge line and connected with a third port of the component.