Multi-Port Discharger for Substrate Peripheral Liquid Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate processing methods struggle to accurately control the shape of coating films at the peripheral portion of substrates, leading to inaccuracies in processing due to protrusions and rebounding of processing liquids.
Innovation Solution
A peripheral portion processing device with a discharger having multiple discharge ports arranged in one direction, which selectively discharges processing liquid to positions further outward than the inner edge of the substrate's peripheral portion, reducing rebound and allowing for precise control of the processing liquid's placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If processing liquid is discharged to the peripheral portion of the substrate using conventional methods, then the coating film can be formed on the substrate surface, but protrusions are generated at the outer periphery and the shape of the coating film cannot be controlled accurately
Solution Approach 1:
The discharger is designed with multiple discharge ports arranged in one direction, allowing selective discharge of processing liquid to specific regions. The discharge controller selectively activates discharge ports to direct liquid to positions further outward than the inner edge of the peripheral portion, creating localized quality control over liquid distribution and preventing unwanted protrusions.
Solution Approach 2:
The discharger is divided into multiple discharge ports that can be independently controlled. This segmentation allows precise control over where the processing liquid is discharged, enabling the system to target specific areas outward of the peripheral portion while avoiding the inner edge region, thus controlling coating film shape accurately.
2Manufacturing precision
If processing liquid is discharged at high pressure to ensure adequate coverage, then the liquid can reach the peripheral portion, but rebounding occurs and processing accuracy is reduced
Solution Approach 1:
By using multiple discharge ports with selective control, the system can direct processing liquid locally to positions further outward than the inner edge of the peripheral portion. This localized discharge approach allows adequate coverage without requiring high pressure, thereby preventing rebounding and maintaining processing accuracy.
3Quantity of substance
If the discharger discharges processing liquid to cover the entire peripheral portion, then complete coverage is achieved, but liquid is supplied to positions further inward than the inner edge causing loss of control
Solution Approach 1:
The discharger is segmented into multiple discharge ports that can be independently controlled. This allows the system to selectively activate only the ports that discharge liquid to positions further outward than the inner edge of the peripheral portion, achieving complete coverage of the target area while preventing liquid supply to positions further inward than the inner edge.
Solution Approach 2:
The discharge controller provides local quality control by selectively activating specific discharge ports based on the rotational position of the substrate. This ensures processing liquid is discharged only to the intended peripheral portion area outward of the inner edge, maintaining precise position control while achieving adequate coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables high-accuracy processing of the substrate's peripheral portion by preventing liquid rebound and eliminating protrusions, ensuring precise removal or application of coating films.
Implementation Method 1
a discharger (212) having a plurality of discharge ports (213) arranged in one direction and configured to be capable of selectively discharging the processing liquid from the plurality of respective discharge ports (213)
Implementation Method 2
a rotation holder (25) that holds and rotates the substrate (W)
Data Source
AI summary
A substrate is held and rotated by a spin chuck. A processing liquid is discharged from a discharger to the substrate rotated by the spin chuck. The discharger has a plurality of discharge ports arranged in one direction and can selectively discharge the processing liquid from the plurality of respective discharge ports. With a row of the plurality of discharge ports of the discharger crossing and facing a peripheral portion of the substrate rotated by the spin chuck, the processing liquid is supplied to a position further outward than an inner edge of the peripheral portion. The processing liquid is not supplied to a position further inward than the inner edge of the peripheral portion of the substrate.