Multi-Probe Card Structure for Stable High-Frequency Contact
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Solution Overview
Problem
Conventional probe cards face challenges in maintaining reliable electrical contact due to irregularities on electrode pads and foreign substances, leading to reduced contact area and current capacity, while also struggling with plastic deformation and stress concentration during high-frequency inspections.
Innovation Solution
A probe card design featuring independently buckling probes with offset guide holes, friction reduction films, and locking parts to prevent interference and dislodgement, allowing probes to adapt to uneven electrode surfaces and foreign substances, and maintaining high-frequency characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the probe length is shortened to improve high-frequency characteristics, then the inductance is reduced and high-frequency performance is enhanced, but the probe requires greater bending during overdrive which increases stress and may cause plastic deformation
Solution Approach 1:
The patent changes the physical parameters of the probe by reducing its thickness in the bending direction. This parameter modification allows the shorter probe to achieve the necessary buckling deformation for overdrive while maintaining elastic force, as the reduced thickness lowers the stress generated during bending despite the increased curvature required
Solution Approach 2:
The patent enables dynamic elastic deformation of the probe during overdrive by positioning it between two guide plates. The probe dynamically buckles and deforms elastically under applied force, allowing it to maintain contact with electrode pads while absorbing height variations. The guide plates constrain the deformation to controlled paths, ensuring the probe returns to its original position after overdrive
2Reliability
If the probe thickness is reduced to suppress stress during overdrive, then plastic deformation is prevented and elastic force is maintained, but the cross-sectional area decreases leading to reduced current capacity
Solution Approach 1:
The patent transitions from a single thick probe to multiple thinner probes arranged in parallel. By distributing the current load across multiple probes, the system maintains adequate current capacity while each individual probe has reduced thickness to minimize stress during buckling deformation. This dimensional arrangement allows simultaneous optimization of both elastic performance and current carrying capability
3Device complexity
If a single probe is used to contact the electrode pad, then the structure is simple, but contact failures occur due to irregularities on the electrode pad surface or foreign substances
Solution Approach 1:
The patent divides the single probe function into multiple probes within the same probe group. Each probe independently contacts the electrode pad, so if one probe fails to make proper contact due to surface irregularities or foreign substances, other probes can still establish electrical connection. This segmentation of the contact function significantly improves reliability without requiring complex active control mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances reliability by ensuring consistent contact and current endurance, while improving high-frequency performance and reducing probe interference.
Implementation Method 1
The probes elastically deform due to the overdrive, biasing them towards the electrode pads
Implementation Method 2
generate elastic force by buckling deformation
Data Source
AI summary
[Problem] The objective is to provide a probe card that are less prone to contact failure, with good high-frequency characteristics, current endurance, and good conductivity. [Solution] A probe card includes a wiring board 10 formed with one or more probe electrodes 102, an upper guide plate 13 spaced below the wiring board 10 and facing the wiring board 10, formed with one or more upper guide holes 131, a lower guide plate 14 spaced below the upper guide plate 13 and facing the upper guide plate 13, formed with one or more lower guide holes 141, and a probe group 15G including two or more probes 15 that are inserted through a same upper guide hole 131 and a same lower guide hole 141 and connected to a same probe electrode 102 and a same electrode 201 of an object to be inspected, wherein the probes 15 of the probe group 15G are capable of independently each other buckling deformation between the upper guide plate 13 and the lower guide plate 14, and their lower ends are capable of moving independently each other in a vertical direction.