Multi-Probe Test Device for Semiconductor Contact Reliability
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Solution Overview
Problem
Conventional MEMS probe cards face issues with contact reliability due to increased contact resistance and deformation effects on support members, leading to reduced test reliability and difficulty in diagnosing defects in high-density semiconductor testing.
Innovation Solution
The test device incorporates a design with main and sub contact probes, each with elastic deformation portions and sliding contact portions, separated by slots, which are inserted into guide and terminal holes, allowing for improved contact reliability and reduced contact resistance by minimizing deformation effects on support members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a high-density probe card with many MEMS probes is used to test larger semiconductor wafers, then the number of testable pads increases, but contact reliability deteriorates due to sliding and movement of contact portions
Solution Approach 1:
The probe card is divided into multiple independent probe units, each with its own support member. This segmentation allows each probe to be individually stabilized while maintaining high overall density, resolving the contradiction between quantity and reliability.
Solution Approach 2:
A support member is introduced as an intermediary between the elastic deformation portion and the contact portion. This support member stabilizes the contact portion, preventing sliding and movement, thereby maintaining contact reliability while allowing high-density probe arrangement.
2Productivity
If MEMS probes are repeatedly pressed against test terminals, then test coverage increases, but contact resistance increases due to wear and contamination
Solution Approach 1:
The contact portion is designed with changeable parameters including replaceable contact tips and adjustable contact pressure. This allows maintenance of optimal contact conditions throughout repeated testing, preventing contact resistance increase while maintaining high productivity.
3Force
If support members are excessively urged by deformation of elastic deformation portions, then probe contact force is maintained, but adjacent test probes are affected negatively
Solution Approach 1:
Each probe is equipped with an independent support member, segmenting the force transmission paths. This prevents excessive urging from one probe from affecting adjacent probes, maintaining proper contact force for each probe while ensuring adjacent probe test reliability.
4Reliability
If conventional MEMS probes are used, then initial contact is achieved, but defect diagnosis becomes difficult when probes are damaged
Solution Approach 1:
The contact portion is designed to be replaceable and recoverable. When wear or damage occurs, the contact portion can be easily replaced rather than discarding the entire probe card. This maintains initial contact reliability while significantly reducing defect diagnosis difficulty and restoring probe functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances contact reliability, reduces contact resistance, and facilitates easy replacement of defective probes, thereby improving the overall reliability and lifespan of the test device.
Implementation Method 1
a main elastic deformation portion connecting the main sliding contact portion and the main terminal contact portion and elastically deformed by compression of a lengthwise direction
Data Source
AI summary
A test device for testing electric characteristics of an object to be tested. The test device includes: a first support member comprising a plurality of guide holes; a second support member comprising a plurality of terminal holes and arranged to be spaced apart from and in parallel with the first support member; a plurality of main contact probes; and a plurality of sub contact probes arranged to be adjacent to the main contact probes along a lengthwise direction. According to the present disclosure, contact reliability is improved by multi contact with the terminal of the test circuit board (interposer) and/or the object to be tested.