Multi-prober Chuck Assembly for Parallel Wafer Testing
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Solution Overview
Problem
Conventional substrate inspection apparatuses can only inspect one substrate at a time, leading to long inspection times and limited throughput in semiconductor device production.
Innovation Solution
A multi-prober chuck assembly and channel system that allows simultaneous electrical testing of multiple wafers, incorporating a probe card structure, a chuck, a heater, conductive guard plates, and a body part to form a cartridge-type structure, with features such as insulating members, AC shielding, and adjustable positioning to reduce electromagnetic noise and leakage current.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single probe apparatus is used to inspect substrates, then the inspection process is simple, but the inspection time is long and throughput is limited
Solution Approach 1:
The apparatus is divided into multiple independent probe units (first probe unit, second probe unit, etc.), each capable of inspecting a substrate simultaneously. This segmentation allows parallel processing of multiple substrates, thereby increasing throughput and reducing total inspection time while maintaining manageable complexity in each individual probe unit
2Productivity
If multiple probes are used to increase throughput, then inspection speed improves, but electromagnetic noise and leakage current increase
Solution Approach 1:
Conductive guard plates are introduced as intermediary elements between the probes and the high-impedance signal lines. These guard plates act as electrostatic shields that redirect leakage current away from sensitive measurement circuits and reduce electromagnetic interference, enabling high-throughput multi-probe operation while maintaining signal integrity
Solution Approach 2:
The leakage current and electromagnetic noise that naturally increase with multiple probes are converted into a beneficial shielding effect. By strategically placing conductive guard plates, the harmful leakage current is redirected to create electrostatic shields that protect sensitive measurement circuits, transforming the harmful multi-probe effect into a protective mechanism
3Productivity
If a multi-prober system is implemented, then test throughput increases, but the system complexity increases
Solution Approach 1:
The apparatus uses identical, standardized probe units that can perform the same inspection functions across multiple positions. Each probe unit is a universal module that can be replicated and arranged in different configurations, allowing the system to handle multiple substrates simultaneously while maintaining uniformity and reducing overall system complexity through standardization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system significantly increases test throughput by enabling multiple wafer testing while effectively suppressing electromagnetic noise and leakage current, enhancing production efficiency and reducing noise interference.
Implementation Method 1
a heater for heating the chuck under the chuck
Implementation Method 2
a conductive guard plate spaced apart from the heater below the heater
Data Source
AI summary
A multi-prober chuck assembly and channel are provided. The multi-prober chuck assembly, according to one embodiment of the present invention, comprises: a chuck for supporting a wafer; a probe card structure coupled to the top part of the chuck; a heater for heating the chuck under the chuck; a conductive guard plate spaced apart from the heater below the heater; and a body part positioned under the chuck so that the heater and the guard plate are positioned inside the body part, wherein the probe card structure and the body part are coupled mechanically to form a cartridge-type structure.