Multi-Probing Probe Card with Interchangeable Test Boards
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Solution Overview
Problem
Existing probe cards are inefficient for testing multiple types of semiconductor chips as they require replacement for different chip types, leading to prolonged test times and reduced accuracy, especially when dealing with large numbers of chips.
Innovation Solution
A multi-probing probe card with a modular design featuring interchangeable test boards with different needle array configurations, allowing for selection of specific boards to contact the PCB, enabling testing of various semiconductor chip types using distinct probing methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a single type probe card is used to test semiconductor chips one-by-one, then accurate testing can be realized, but test time is prolonged and productivity is degraded
Solution Approach 1:
The probe card is divided into multiple test boards (first test board, second test board, third test board, fourth test board), each capable of testing different numbers of chips simultaneously. This segmentation allows the system to switch between single-chip testing (for accuracy) and multi-chip parallel testing (for productivity) based on test requirements.
Solution Approach 2:
The probe card employs movable test boards that can be selectively positioned into contact with the PCB. The first test board can be moved to contact the PCB for single-chip testing, while the second test board can be moved for four-chip parallel testing. This dynamic reconfiguration enables the system to adapt between different testing modes to balance accuracy and productivity.
2Productivity
If a multi-type probe card is used to simultaneously probe multiple semiconductor chips, then test time is reduced and productivity is improved, but test accuracy is not ensured
Solution Approach 1:
The probe card is divided into multiple test boards (first test board, second test board, third test board, fourth test board), each capable of testing different numbers of chips simultaneously. This segmentation allows the system to switch between single-chip testing (for accuracy) and multi-chip parallel testing (for productivity) based on test requirements.
Solution Approach 2:
The probe card employs movable test boards that can be selectively positioned into contact with the PCB. The first test board can be moved to contact the PCB for single-chip testing, while the second test board can be moved for four-chip parallel testing. This dynamic reconfiguration enables the system to adapt between different testing modes to balance accuracy and productivity.
3Measurement precision
If a probe card is designed to probe predetermined type of semiconductor chips, then specialized testing can be achieved, but replacement is required for other chip types which is time consuming
Solution Approach 1:
The probe card is designed with multiple test boards that can be selectively used for different chip types and testing requirements. The system can switch between single-chip testing mode and multi-chip parallel testing mode, and can accommodate different chip configurations (e.g., 1x1, 2x2, 4x1 arrays). This multi-functionality eliminates the need for complete probe card replacement when testing different chip types.
Solution Approach 2:
The probe card employs movable test boards that can be selectively positioned into contact with the PCB. The first test board can be moved to contact the PCB for single-chip testing, while the second test board can be moved for four-chip parallel testing. This dynamic reconfiguration enables the system to adapt between different testing modes to balance accuracy and productivity.
Data Source
AI summary
A probe card capable of multi-probing includes a print circuit board having a plurality of contact portions and a test module having a plurality of test boards. Each of the test boards includes at least one probing portion on which a plurality of needles are arrayed. The test module selects one of the test boards and probes semiconductor chips formed on a semiconductor wafer through the needles arrayed on the probing portion of the selected test board.