Multi-Product IC Die Packaging for Cost Reduction
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Solution Overview
Problem
The high cost of manufacturing multiple integrated circuit (IC) variants with varying logic capacities is a challenge, as each variant requires a new mask set, which can be expensive, and existing methods do not efficiently manage localized defects or customer demand variations.
Innovation Solution
A method involving a multi-product IC die that can be packaged to render certain portions non-operational, allowing for the creation of multiple IC variants from a single die, with configuration options controlled by a product selection code, enabling cost-effective production and defect management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a new mask set is created for each IC variant in the family, then each variant can be manufactured with precise design specifications, but the manufacturing cost increases significantly
Solution Approach 1:
A single mask set is designed to produce a multi-product die that can be packaged as multiple different IC variants. The die includes portions that can be selectively rendered operational or non-operational through packaging decisions, allowing one mask set to serve multiple product families and reducing the need for separate mask sets for each variant.
Solution Approach 2:
The packaging process dynamically determines which portions of the die are rendered operational or non-operational based on customer demand and defect characteristics. This dynamic configuration allows the same physical die to be adapted into different functional variants without requiring separate manufacturing processes for each variant.
2Ease of manufacture
If multiple IC variants are produced from a single die, then manufacturing cost is reduced, but the device complexity increases
Solution Approach 1:
The die is divided into multiple distinct portions, each capable of being independently rendered operational or non-operational. This segmentation allows flexible configuration of IC variants by selectively activating or deactivating specific portions during packaging, enabling cost-effective production of multiple variants from a single die structure.
3Productivity
If defective portions of a die are rendered non-operational, then the overall yield improves, but the functional capacity of the IC is reduced
Solution Approach 1:
Defective portions of the die are intentionally rendered non-operational during packaging, converting the harm of defects into a benefit by enabling the production of multiple IC variants from a single die. This approach improves manufacturing yield by salvaging dies that would otherwise be discarded, while the reduced logic capacity of individual variants is acceptable given the cost savings and increased production volume.
Data Source
AI summary
Methods of manufacturing a family of packaged integrated circuits (ICs) having at least two different logic capacities. A first IC die includes two different portions, of which at least one portion can be deliberately rendered non-operational in some manner (e.g., non-functional, inaccessible, and/or non-programmable) within the package. A first set of the first IC dies are packaged such that both portions of the dies are operational. A second set of the first IC dies are packaged such that only the first portion of each die is operational. Once the first and second sets are packaged and the second set of ICs has been evaluated, a decision is made whether or not to manufacture a second IC die that includes the first portion of the first die, while excluding the second portion.