Multi-Product IC Die Segmentation via Product Selection Codes
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Solution Overview
Problem
The high cost of manufacturing multiple integrated circuit (IC) variants with varying logic capacities is a challenge, as each variant requires a new mask set, which can be expensive, and existing methods do not efficiently manage localized defects or customer demand effectively.
Innovation Solution
A method involving a multi-product IC die that can be packaged to render certain portions non-operational, allowing for the creation of multiple IC variants from a single die, with configuration options controlled by a product selection code, enabling cost-effective production and defect management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a new mask set is created for each IC variant in the family, then each variant can be manufactured with precise logic capacity, but the manufacturing cost increases significantly
Solution Approach 1:
The single IC die is segmented into multiple operational portions through the use of product selection codes. Each code enables or disables specific portions of the die, allowing a single mask set to produce multiple logic capacity variants. This segmentation approach eliminates the need for separate mask sets for each variant while maintaining precise control over the logic capacity of each product family member.
Solution Approach 2:
The patent changes the operational parameters of the IC die by using product selection codes to enable or disable specific portions of the device. By modifying which portions are operational through software-controlled codes rather than physical mask differences, the logic capacity can be varied across product families without requiring new mask sets, thus reducing manufacturing costs while maintaining precision.
2Ease of manufacture
If multiple IC variants are produced from a single die, then manufacturing cost decreases, but device complexity increases due to the need for product selection codes and portion management
Solution Approach 1:
The IC die includes built-in product selection code storage and portion selection logic that automatically configures which portions are operational based on the stored code. This self-service mechanism eliminates the need for external configuration hardware or complex packaging variations, reducing overall device complexity while enabling multiple variants from a single die design.
3Ease of manufacture
If certain portions of the die are rendered non-operational, then cost savings are achieved for smaller logic capacities, but the reliability of the operational portions may be affected by defect distribution
Solution Approach 1:
The patent converts the presence of localized defects into a benefit by using product selection codes to disable portions of the die containing defects. Instead of discarding the entire die, the system selectively renders defective portions non-operational while keeping healthy portions functional. This approach transforms a harmful factor (defects) into a useful mechanism for cost-effective variant production, as dies with localized defects can still be sold as smaller logic capacity variants.
Data Source
AI summary
A method of providing a family of integrated circuits (ICs) includes applying a first product selection code (PSC) to a first IC die, applying a second PSC to a second IC die, and providing a third packaged IC die. The first IC die includes first and second portions, both of which are operational based on the first PSC. The second IC die is a duplicate of the first die, but the second portion is rendered non-operational by the second PSC. The third IC die is substantially similar to the first portion of the first die. The second and third packages can be the same and the packaged dies can be interchangeable in a system. When the dies are programmable logic device (PLD) dies, the second and third dies use the same configuration bit stream, which may be smaller than the configuration bit stream for the first IC die.