Multi-Product IC Die Segmentation for Variable Logic Capacity

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Solution Overview

Problem

The high cost of manufacturing multiple integrated circuit (IC) variants with varying logic capacities is a challenge, as each variant requires a new mask set, which can be expensive, and existing methods do not efficiently manage localized defects or customer demand effectively.

Innovation Solution

A method involving a multi-product IC die that can be packaged to render certain portions non-operational, allowing for the same die to be configured as multiple ICs with different logic capacities, and using a product selection code to control the operational state of the die, enabling cost-effective production and defect management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a new mask set is created for each IC variant in the family, then each variant can be manufactured with precise logic capacity, but the manufacturing cost increases significantly

Engineering Contradiction:

Improvelogic capacity specificationVSAvoidmanufacturing cost

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The IC die is divided into multiple portions with different logic capacities. A single die can be segmented into different operational regions (e.g., first portion and second portion) that can be independently activated or deactivated through packaging decisions, allowing one mask set to produce multiple logic capacity variants.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A single IC die design serves multiple functions by being capable of operating in different configurations. The same die structure can be packaged to provide full logic capacity or reduced logic capacity variants, making the manufacturing process universal for producing the entire IC family rather than requiring separate processes for each variant.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If multiple IC variants are produced from different die designs, then each variant optimally meets customer requirements, but the production complexity and cost increase

Engineering Contradiction:

Improvecustomer demand accommodationVSAvoidproduction process complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The packaging process dynamically determines the operational state of different die portions. By controlling which portions are rendered operational during packaging (based on product selection codes), the system adapts a single die design to meet different customer requirements without changing the underlying die structure or manufacturing process.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The logic capacity parameter is changed not by altering the die design but by changing the operational state of die portions through packaging decisions. Product selection codes and packaging configurations serve as parameters that control whether the first portion, second portion, or both portions of the die are operational, thereby adapting the product to customer needs.

Inventive Principle:

Principle #35Parameter changes

3Reliability

If localized defects occur in a die, then the entire die must be discarded, but this results in waste of functional logic capacity

Engineering Contradiction:

Improvedefect managementVSAvoidfunctional logic capacity

Core Design Contradiction:

ReliabilityVSLoss of substance

Solution Approach 1:

The defective second portion is extracted or removed from the operational configuration through packaging decisions. By rendering the defective portion non-operational and only activating the first portion, the system isolates the defect and prevents it from affecting the functional logic capacity of the first portion, thereby salvaging usable product.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The localized defect is converted into a benefit by using it to define the boundary between operational and non-operational portions. The defect becomes a natural demarcation point that allows the functional first portion to be packaged and sold as a reduced-capacity variant, turning a manufacturing imperfection into a viable product configuration.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Data Source

PatentUS7345507B1Multi-product die configurable as two or more programmable integrated circuits of different logic capacities

Publication Date: 2008.03.18 XILINX INC

AI summary

A multi-product integrated circuit die includes at least two different portions, of which at least one portion can be deliberately rendered non-operational in some manner (e.g., non-functional, inaccessible, and/or non-programmable) within the package. A selection code storage circuit stores a product selection code. A first value of the product selection code selects the option where both the first and second portions of the first die are operational. A second value of the product selection code selects the option where only the first portion of the first die is operational. The selection code storage circuit can include non-volatile memory or a fuse structure, or the product selection code can be configured as a package bonding option. The product selection code can also enable boundary scan for the operational portion of the die, and omit from the boundary scan chain any portions of the die that are deliberately rendered non-operational.