Metal-Configurable Multi-Protocol PHY for Variable Bump Pitch

Solution Overview

Problem

Current chiplet interfacing technologies require multiple product versions to support various bump pitches and protocols, leading to increased development costs and schedules, as well as incompatibilities with different manufacturing processes and standards.

Innovation Solution

The implementation of a metal-configurable multi-protocol PHY using bit-slice tiles that can be easily customized for multiple protocols and bump pitches, allowing for flexible integration with various chiplets and SoCs, regardless of their manufacturing processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple product versions are used to support various bump pitches and protocols, then compatibility with different standards is improved, but development costs and schedules increase

Engineering Contradiction:

Improvecompatibility with different bump pitches and protocolsVSAvoiddevelopment schedules

Core Design Contradiction:

Adaptability or versatilityVSLoss of time

Solution Approach 1:

The PHY is designed with a universal architecture that can operate with multiple bump pitches (e.g., 40-micron and 130-micron) and support different communication protocols (UCIe, BoW, PCIe) through a single product version. This is achieved by making the bump pitch and protocol selection configurable parameters rather than fixed design choices, allowing one PHY design to serve multiple interfaces and standards.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The PHY incorporates dynamic configurability where the bump pitch and protocol can be selected and changed based on the specific application requirements. This dynamic adaptation allows the same physical layer device to reconfigure itself for different interfaces, eliminating the need for multiple static product versions and reducing development overhead.

Inventive Principle:

Principle #15Dynamics

2Adaptability or versatility

If multiple product versions are used to support various bump pitches and protocols, then compatibility with different standards is improved, but development costs increase

Engineering Contradiction:

Improvecompatibility with different bump pitches and protocolsVSAvoiddevelopment costs

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The PHY is designed with a universal architecture that can operate with multiple bump pitches (e.g., 40-micron and 130-micron) and support different communication protocols (UCIe, BoW, PCIe) through a single product version. This is achieved by making the bump pitch and protocol selection configurable parameters rather than fixed design choices, allowing one PHY design to serve multiple interfaces and standards.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The invention utilizes parameter changes to achieve multi-protocol and multi-bump-pitch support. By configuring the PHY with different operational parameters (bump pitch values, protocol modes) rather than creating different hardware designs, the same device can adapt to various standards, significantly reducing development and manufacturing costs.

Inventive Principle:

Principle #35Parameter changes

3Manufacturing precision

If fixed bump pitch designs are used, then manufacturing precision is improved, but adaptability to different chiplet configurations is reduced

Engineering Contradiction:

Improvebump pitch consistencyVSAvoidsupport for different bump pitches

Core Design Contradiction:

Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The PHY incorporates dynamic configurability where the bump pitch and protocol can be selected and changed based on the specific application requirements. This dynamic adaptation allows the same physical layer device to reconfigure itself for different interfaces, eliminating the need for multiple static product versions and reducing development overhead.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The invention utilizes parameter changes to achieve multi-protocol and multi-bump-pitch support. By configuring the PHY with different operational parameters (bump pitch values, protocol modes) rather than creating different hardware designs, the same device can adapt to various standards, significantly reducing development and manufacturing costs.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS20240320186A1Metal-Configurable Multi-Protocol PHY

Publication Date: 2024.09.26 YORCHIP INC

AI summary

An IC, e.g., a bare die, includes an array of bit-slice tiles. Each bit-slice tile has a ground circuit, a supply circuit, an ESD protection circuit, and a bit-transmit circuit and/or bit-receive circuit for a communication protocol, such as UCIe and/or BoW. Bondpads, using an interconnect layer that can be at or near the top of the metal stack, are placed over one or more bit-slice tiles, and can connect with one or more of the circuits in these one or more of the bit-slice tiles.To configure the IC, one selects a communication protocol, bump pitch, and number of data bits. Based on the bump pitch, the number of bit-slice tiles per data bits is determined, and tiles are grouped for each bondpad to be used. In each group, the bondpad is created in a top interconnect layer, and connected with a circuit in a bit-slice in the group.