Multi-Radiation Antenna Structure for Mobile Devices

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Solution Overview

Problem

Designing a small-size, wideband antenna element for mobile devices is challenging due to limited interior space, as existing solutions struggle to accommodate necessary antenna elements for various frequency bands while maintaining efficiency and compactness.

Innovation Solution

A novel antenna structure is proposed, comprising a main circuit board and a PCB with specific radiation elements and connection elements arranged in a 3D configuration, allowing for efficient coverage of multiple frequency bands (700 MHz to 2700 MHz) by optimizing element lengths and gaps, and incorporating a metal element for enhanced current paths.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of moving object

If traditional antenna designs are used, then frequency coverage can be achieved, but the antenna size becomes too large for mobile device interiors

Engineering Contradiction:
Improveantenna sizeVSAvoidfrequency band coverage
Core Design Contradiction:
Area of moving objectVSAdaptability or versatility

Solution Approach 1:

The patent transitions from planar antenna elements to a three-dimensional configuration by positioning radiation elements on both the main circuit board and the PCB, which are arranged substantially perpendicular to each other. This spatial arrangement allows the antenna structure to achieve wideband operation across multiple frequency bands (700 MHz to 2700 MHz) while maintaining a compact footprint suitable for mobile device interiors.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The antenna structure integrates multiple radiation elements (first through fifth radiation elements) and connection elements within the existing mobile device housing structure. The elements are nested on available surfaces of the main circuit board and PCB, utilizing the device's internal geometry to accommodate a complex multi-band antenna system without increasing external dimensions.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Adaptability or versatility

If multiple antenna elements are added to cover different frequency bands, then frequency coverage improves, but device complexity increases

Engineering Contradiction:
Improvefrequency band coverageVSAvoidantenna structure complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines multiple radiation elements and connection elements into a single integrated antenna structure that operates across multiple frequency bands. The first radiation element coupled to the feeding connection element, the grounding connection element adjacent to it, and additional radiation elements distributed on both the main circuit board and PCB work together as one unified system, eliminating the need for separate antennas for different frequency bands.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The antenna structure is designed to perform multiple functions simultaneously by covering a wide frequency range from 700 MHz to 2700 MHz, which includes 2G, 3G, LTE, Wi-Fi, and Bluetooth frequency bands. This multi-functional design allows a single antenna structure to replace what would traditionally require multiple separate antenna elements.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Area of moving object

If antenna elements are miniaturized to fit mobile devices, then space constraints are satisfied, but manufacturing precision requirements increase

Engineering Contradiction:
Improveantenna sizeVSAvoidelement positioning precision
Core Design Contradiction:
Area of moving objectVSManufacturing precision

Solution Approach 1:

The antenna structure is divided into discrete radiation elements and connection elements that are separately defined and positioned on the main circuit board and PCB. Each element (first radiation element, second radiation element, third radiation element, fourth radiation element, fifth radiation element, feeding connection element, grounding connection element) is independently configured with specific dimensions and spacing, allowing for standardized manufacturing processes and reduced precision requirements compared to a monolithic miniaturized antenna.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The antenna structure achieves wideband operation with small size, low complexity, and low manufacturing costs, suitable for various mobile communication devices, effectively addressing the space constraints and frequency coverage requirements.

Implementation Method 1

a first radiation element coupled to the feeding connection element... a second radiation element coupled to the feeding connection element... The antenna structure covers a first frequency band, a second frequency band, and a third frequency band

Methodology Applied
Scientific EffectElectromagnetic radiation: Electromagnetic Induction

Data Source

PatentUS10727588B2Mobile device
Publication Date: 2020.07.28 QUANTA COMPUTER INC
  • US10727588B2 patent drawing
  • US10727588B2 patent drawing
  • US10727588B2 patent drawing

AI summary

A mobile device includes a main circuit board, a PCB (Printed Circuit Board), a feeding connection element, a grounding connection element, a first radiation element, a second radiation element, a third radiation element, a fourth radiation element, and a fifth radiation element. The first radiation element is coupled to the feeding connection element. The second radiation element is coupled to the feeding connection element. The third radiation element is coupled to the grounding connection element. The fourth radiation element is coupled to the first radiation element. The fifth radiation element is coupled to the feeding connection element. The feeding connection element, the grounding connection element, the first radiation element, and the second radiation element are disposed on the main circuit board. The third radiation element, the fourth radiation element, and the fifth radiation element are disposed on the PCB.