Multi-Radiation Semiconductor Sensor with Selective Films

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Solution Overview

Problem

Current radiation sensors are limited as they can only measure single types of radiation, requiring multiple sensors and complex electronic circuits, which are costly and inefficient.

Innovation Solution

A semiconductor-based radiation measuring sensor with multiple sensing films and electrodes on a single substrate, capable of detecting alpha, beta, X-ray, and gamma radiation using a single electronic circuit, allowing for the measurement of different radiations with a unified instrument.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If multiple radiation sensors are used to measure different types of radiation, then measurement precision is improved, but device complexity increases and cost increases

Engineering Contradiction:
Improveradiation measurement precisionVSAvoidsensor system complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent combines multiple radiation sensing functions into a single sensor device. Multiple sensing films (e.g., first sensing film for alpha/beta radiation, second sensing film for X-ray/gamma radiation) are integrated on one semiconductor substrate with shared electrodes and circuitry, eliminating the need for separate sensors for different radiation types.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The sensor device is designed to perform multiple radiation detection functions simultaneously. The same sensor structure with different sensing films can detect various types of radiation (alpha, beta, X-ray, gamma), making a single device universal for multiple measurement purposes that previously required different specialized sensors.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If multiple radiation sensors are used to measure different types of radiation, then measurement range is improved, but cost increases

Engineering Contradiction:
Improveradiation measurement rangeVSAvoidmanufacturing cost
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

Multiple sensing films are fabricated on a single semiconductor substrate using integrated manufacturing processes. The shared electrodes, interconnect structures, and readout circuitry reduce material costs, assembly expenses, and manufacturing complexity compared to producing and assembling multiple separate sensors.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

A single sensor device provides universal detection capability across multiple radiation types through the use of different sensing films, eliminating the need to purchase and maintain multiple specialized sensors, thereby reducing overall system cost while expanding measurement range.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If different radiation sensors are used, then adaptability to different radiations is improved, but device complexity increases

Engineering Contradiction:
Improveradiation type adaptabilityVSAvoidelectronic circuit complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The sensor integrates multiple sensing films with different radiation sensitivities on a common substrate with shared electrodes and electronics. This unified structure detects various radiation types through a single device architecture, avoiding the complexity of coordinating multiple independent sensors and their separate circuit systems.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables cost-effective and miniaturized radiation measurement across various types of radiation using a single sensor and electronic circuit, reducing the need for multiple sensors and enhancing measurement precision and range.

Implementation Method 1

sensing films which are formed on the plurality of top electrodes and react with different materials

Methodology Applied
Scientific EffectRadiation interaction with sensing films: Absorption (EM radiation)

Data Source

PatentUS10620325B2Different radiation measuring sensor and manufacturing method thereof
Publication Date: 2020.04.14 KOREA ATOMIC ENERGY RES INST
  • US10620325B2 patent drawing
  • US10620325B2 patent drawing
  • US10620325B2 patent drawing

AI summary

Disclosed herein is a different radiation measuring sensor and a manufacturing method thereof. The different radiation measuring sensor includes a semiconductor substrate, at least one bottom electrode formed on a bottom surface of the semiconductor, a plurality of top electrodes formed on a top surface of the semiconductor and electrically connected to the bottom electrode, and sensing films formed on the plurality of top electrodes and reacting with different materials.