Multi-Region Pressure Sensor Chip Package for PCB Area Reduction
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Solution Overview
Problem
The use of multiple pressure sensor chip packages increases costs and requires more area, as each sensor package needs to be individually fabricated and mounted on a printed circuit board, leading to inefficiencies in manufacturing and space usage.
Innovation Solution
A single chip package with multiple pressure sensor regions is developed, where the chip is encapsulated with a molding material that allows for simultaneous measurement of different pressures using a System-On-Chip (SoC) solution, incorporating membrane structures for capacitance, piezoresistance, or pizeoelectricity-based pressure detection, and fluid supply structures for differential sensing, reducing the need for multiple packages and area usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple pressure sensor chip packages are used to measure different pressures, then the measurement capability is improved, but the manufacturing cost and area requirements increase
Solution Approach 1:
The patent combines multiple pressure sensor regions on a single chip package, allowing simultaneous measurement of different pressures (e.g., process pressure, reference pressure, differential pressure) without requiring multiple separate packages. This merging approach reduces manufacturing complexity and area requirements while maintaining measurement versatility
Solution Approach 2:
The chip package is designed with multiple pressure sensor regions that can perform different measurement functions simultaneously. The single package serves multiple purposes: measuring process pressure, reference pressure, and differential pressure, making it a multi-functional device that replaces what would traditionally require multiple separate packages
2Measurement precision
If multiple independent pressure sensor packages are fabricated and mounted, then the measurement precision is improved, but the manufacturing process complexity increases
Solution Approach 1:
Multiple pressure sensor regions are integrated on a single chip during the semiconductor fabrication process, eliminating the need for separate fabrication and mounting steps for each sensor package. This reduces manufacturing process complexity while maintaining the precision benefits of multiple sensors
3Adaptability or versatility
If multiple pressure sensor chip packages are used, then the measurement versatility is improved, but the area occupied on the printed circuit board increases
Solution Approach 1:
The patent merges multiple pressure sensor functions into a single chip package, significantly reducing the area required on the printed circuit board. Instead of mounting multiple separate packages, only one package is needed to provide the same measurement versatility, thus minimizing PCB area occupation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs and area requirements by integrating multiple pressure sensors into a single package, enabling simultaneous measurement of various pressures with improved efficiency and compact design.
Implementation Method 1
membrane structures for capacitance, piezoresistance, or pizeoelectricity-based pressure detection
Implementation Method 2
membrane structures for capacitance, piezoresistance, or pizeoelectricity-based pressure detection
Implementation Method 3
membrane structures for capacitance, piezoresistance, or pizeoelectricity-based pressure detection
Data Source
AI summary
In various embodiments, a chip package is provided. The chip package may include at least one chip having a plurality of pressure sensor regions and encapsulation material encapsulating the chip.