Multi-Resin Electronic Packaging to Resist Thermal Interface Peeling

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Solution Overview

Problem

The thermal stress at the interface between the semiconductor substrate and hermetic seal resin due to differing thermal expansion coefficients leads to peeling of the hermetic seal resin, reducing the reliability of electronic devices.

Innovation Solution

The electronic device incorporates a first resin layer with a first conductor penetrating it, a first wiring layer straddling the resin layer and conductor, a first electronic component connected to the wiring layer, a second resin layer covering the wiring and component, and an external electrode connected to the conductor, with specific manufacturing steps to form and connect these components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If hermetic seal resin is used to cover electronic components on semiconductor substrate, then electronic components are protected against environmental influence, but thermal stress causes peeling at the interface between substrate and resin

Engineering Contradiction:

Improveprotection of electronic componentsVSAvoidinterface bonding strength

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The hermetic seal structure is divided into multiple resin layers (first resin layer and second resin layer) with different functions. The first resin layer provides mechanical support and electrical insulation, while the second resin layer provides hermetic protection. This segmentation allows each layer to be optimized for its specific function, reducing overall thermal stress and preventing interface peeling.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The first resin layer acts as an intermediary between the semiconductor substrate and the second resin layer. It provides a transition zone that reduces the thermal expansion coefficient mismatch between the substrate and the hermetic seal resin, thereby reducing thermal stress and preventing peeling at the interface.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If single-layer hermetic seal resin is used, then manufacturing process is simple, but thermal stress causes peeling and reduces reliability

Engineering Contradiction:

Improvemanufacturing process simplicityVSAvoidinterface bonding stability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The hermetic seal is segmented into multiple resin layers with distinct functions. The first resin layer is formed by dispensing and curing, while the second resin layer is formed by molding. This segmentation improves reliability by reducing thermal stress, while the processes remain relatively simple and compatible with existing manufacturing techniques.

Inventive Principle:

Principle #1Segmentation

3Strength

If resin layer is made thicker to reduce peeling, then interface bonding is improved, but device size increases

Engineering Contradiction:

Improveinterface bonding strengthVSAvoiddevice size

Core Design Contradiction:

StrengthVSVolume of moving object

Solution Approach 1:

Instead of using a single thick resin layer, the structure is segmented into two thinner layers with different material properties and functions. The first resin layer (thicker) provides mechanical support and insulation, while the second resin layer (thinner) provides hermetic protection. This achieves the necessary interface bonding strength without significantly increasing overall device size.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The hermetic seal structure uses composite material architecture with two different resin layers. Each layer can be optimized for its specific function (mechanical support vs. hermetic protection), achieving superior interface bonding strength while maintaining compact device dimensions compared to a single thick layer.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration suppresses the reduction in reliability by stabilizing the resin layers and maintaining structural integrity under thermal stress, enhancing the device's overall performance.

Implementation Method 1

thermal stress is exerted on the interface between a semiconductor substrate (supporting part) and a hermetic seal resin (protective part) because of the difference in thermal expansion coefficient between the semiconductor substrate and the hermetic seal resin

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS12388043B2Electronic device with multiple resin layers reducing suppression in reliability

Publication Date: 2025.08.12 ROHM CO LTD

AI summary

The present disclosure provides an electronic device. The electronic device includes a first resin layer, having a first resin layer main surface and a first resin layer inner surface; a first conductor, having a first conductor main surface and a first conductor inner surface; a first wiring layer, formed adjacent to the first resin layer main surface and connected to the first conductor main surface; a first electronic component, electrically connected with the first wiring layer; a second resin layer, having a second resin layer main surface facing same direction as the first resin layer main surface and a second resin layer inner surface being in contact with the first resin layer main surface; an external electrode; and a second conductor, penetrating the second resin layer, wherein the second conductor is disposed on a periphery of the first electronic component.