Multi-Role Semiconductor Substrate Layout for Configurable Packaging
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Solution Overview
Problem
Conventional semiconductor packaging processes require separate substrate designs for each semiconductor device assembly configuration, leading to increased manufacturing costs and complexity due to the wide variety of configurations and external connection schemes.
Innovation Solution
A multi-role semiconductor device substrate design with redundant contacts separated by keep-out zones, allowing a single substrate to be adapted for multiple configurations by removing specific regions, enabling similar functionality with a smaller form factor and reduced inventory needs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate substrate designs are used for each semiconductor device assembly configuration, then electrical connectivity and functionality are ensured, but manufacturing costs and device complexity increase
Solution Approach 1:
The substrate is designed with redundant contacts and keep-out zones that allow it to serve multiple configurations and external connection schemes. The same substrate can be adapted for different semiconductor device assemblies by selectively removing regions, eliminating the need for separate substrate designs for each configuration while maintaining electrical connectivity requirements.
Solution Approach 2:
The substrate is divided into functional regions including redundant contacts separated by keep-out zones. This segmentation allows specific regions to be removed based on the required configuration, enabling a single substrate design to accommodate multiple assembly types while maintaining proper electrical connections for each specific application.
2Reliability
If separate substrate designs are used for each configuration, then specific electrical connection schemes are optimized, but manufacturing costs increase
Solution Approach 1:
A single universal substrate design with redundant contacts and keep-out zones replaces multiple configuration-specific substrate designs. This reduces manufacturing costs by standardizing the substrate fabrication process while still optimizing electrical connection schemes for different configurations through selective region removal rather than requiring separate substrate manufacturing for each scheme.
3Adaptability or versatility
If multiple substrate designs are maintained for different configurations, then specific assembly requirements are met, but inventory complexity increases
Solution Approach 1:
The substrate maintains adaptability to multiple assembly configurations through redundant contacts and keep-out zones that allow selective region removal. This single versatile substrate design reduces inventory complexity by eliminating the need to stock multiple different substrate types, while still meeting specific assembly requirements through configuration-specific processing of the same base substrate design.
Data Source
AI summary
A semiconductor device assembly is provided. The assembly includes a substrate having an upper surface on which is disposed a first device contact, a keep-out region extending from a first side surface of the substrate to a second side surface of the substrate opposite the first, and at least one trace coupled to the first device contact and extending across the keep out region towards a third side surface of the substrate. The assembly further includes at least one semiconductor device disposed over the upper surface of the substrate and coupled to the first device contact. The keep-out region of the substrate is free from conductive structures other than the at least one trace.