Multi-Row Lead IC Packaging with Convex-Concave Geometry
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Solution Overview
Problem
The challenge lies in developing an integrated circuit packaging system that can efficiently connect smaller, high-density packages to circuit boards while reducing manufacturing costs and improving reliability, as existing solutions fail to effectively address the need for increased manufacturing throughput and product yields while maintaining competitive pricing and performance.
Innovation Solution
The system involves forming a base structure with specific lead and paddle configurations, applying multi-layer finishes, mounting an integrated circuit device, attaching interconnects, and encapsulating the components, with the outer multi-layer finish exposed, to enhance connectivity and adhesion, thereby simplifying manufacturing and reducing defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the package size is reduced to meet market demand for smaller electronic products, then the product size decreases, but the manufacturing complexity and difficulty of achieving high density connections increases
Solution Approach 1:
The lead structure is segmented into multiple rows with distinct functional zones (peripheral leads for power/ground, intermediate leads for signal connections). This segmentation allows complex high-density connections to be organized into manageable sections, reducing manufacturing complexity while enabling smaller package sizes.
Solution Approach 2:
The patent transitions from traditional single-row lead arrangements to multi-row lead configurations with convex and concave sides. This dimensional change in lead arrangement enables higher connection density within a smaller package footprint while maintaining manufacturability through automated assembly processes.
2Adaptability or versatility
If the number of circuits in smaller packages is increased to provide more functionality, then the product functionality increases, but the need for reduced manufacturing cost and improved yield becomes more critical
Solution Approach 1:
The lead structure is designed with universal applicability across different package types and circuit configurations. The standardized multi-row lead design with specific convex/concave geometries can accommodate various circuit densities and functionalities while maintaining consistent manufacturing processes, thereby improving yield regardless of circuit complexity.
Solution Approach 2:
The patent employs specific geometric parameters (convex and concave lead configurations, multi-layer finishes with controlled thicknesses) that optimize both functionality and manufacturability. These parameter optimizations enable higher circuit densities while maintaining manufacturing yield through improved automated assembly compatibility and reduced defect rates.
3Reliability
If multi-layer finishes are applied to enhance adhesion and reduce defects, then the reliability improves, but the manufacturing process complexity increases
Solution Approach 1:
Multi-layer finishes are applied to the lead structures before final assembly operations. This preliminary application of protective and adhesive coatings ensures proper adhesion and defect prevention are established early in the manufacturing process, simplifying subsequent assembly steps while maintaining high reliability.
Solution Approach 2:
The patent utilizes composite multi-layer finish structures on the leads, combining different material properties (adhesion, corrosion resistance, solderability) in a single integrated coating system. This composite approach improves connection reliability while consolidating multiple protective functions into one manufacturing step, reducing overall process complexity.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: forming a base structure having an intermediate lead with an intermediate concave side and an intermediate convex side, a peripheral lead with a peripheral concave side and a peripheral convex side, and a paddle with a paddle concave side and a paddle convex side; applying an inner multi-layer finish directly on the intermediate concave side, the peripheral concave side, and the paddle concave side; applying an outer multi-layer finish directly on the intermediate convex side, the peripheral convex side, and the paddle convex side; mounting an integrated circuit device over the inner multi-layer finish; attaching an interconnect directly to the inner multi-layer finish on the peripheral concave side and directly to integrated circuit device; and applying an encapsulation over the integrated circuit device, the interconnect, and the base structure, with the outer multi-layer finish exposed from the encapsulation.