Multi-Row Lead Integrated Circuit Packaging for High Density
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Solution Overview
Problem
The increasing demand for high-density, high-performance integrated circuit packages requires more electrical connections in smaller sizes, necessitating innovative solutions for precision placement and increased connectivity while reducing costs and improving reliability.
Innovation Solution
The method involves forming staggered leads with external and internal connection portions, connecting an integrated circuit device, and encapsulating it with exposed leads, followed by a solder mask application to enhance connectivity and protect the components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the package size is reduced to meet miniaturization demands, then the product size decreases, but the number of electrical connections must increase to maintain high density and high output/input requirements
Solution Approach 1:
The patent transitions from traditional single-row or two-row lead arrangements to a multi-row lead configuration, utilizing multiple dimensions of the package footprint to accommodate increased connection density. The leads are arranged in multiple rows extending from different sides of the package, effectively distributing connections across multiple spatial dimensions rather than concentrating them in a single area.
Solution Approach 2:
The electrical connections are segmented into multiple independent rows of leads, with each row providing a subset of the total connections. This segmentation allows the package to achieve high connection density by distributing leads across multiple rows rather than requiring a single dense array, thereby reducing interference and improving manufacturability.
2Quantity of substance
If more electrical connections are added to smaller packages, then the connectivity increases, but the precision required for placement and spacing of connections increases
Solution Approach 1:
The patent employs a standardized lead structure that serves multiple functions: mechanical support, electrical connection, and spatial positioning. Each lead is designed with consistent dimensions, spacing, and orientation, allowing the same manufacturing processes to be used across all connections. This universality reduces the complexity of precision placement by applying the same tolerances and procedures to all leads rather than requiring custom precision for each individual connection.
Solution Approach 2:
The patent optimizes lead parameters such as spacing, width, and orientation to balance connection density with manufacturability. By carefully selecting and standardizing these geometric parameters, the design achieves high connectivity while maintaining tolerances that are feasible with conventional manufacturing processes, thereby reducing the effective precision requirements.
3Device complexity
If traditional packaging structures are used, then the design and manufacturing processes are simple, but they cannot support high density and high output/input integrated circuit requirements
Solution Approach 1:
The patent moves beyond traditional two-dimensional lead arrangements by implementing multi-row configurations that utilize the full perimeter and internal space of the package. Leads are distributed across multiple rows extending from different sides, effectively using three-dimensional space more efficiently to accommodate higher connection counts without proportionally increasing structural complexity.
Solution Approach 2:
The packaging structure is segmented into multiple independent lead rows, each with standardized design elements. This segmentation allows the complex high-density requirement to be broken down into multiple simpler, repeatable units, making the overall complex structure manageable through modular design principles.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: forming a first lead adjacent and staggered to a second lead, the first lead having a first external connection portion with a first external conductive layer and a first internal connection portion, the first external connection portion oriented laterally outwards from the first internal connection portion, and the second lead having a second external connection portion with a second external conductive layer and a second internal connection portion; connecting an integrated circuit device with the first internal connection portion and with the second internal connection portion; forming an encapsulation over the integrated circuit device with the first lead and the second lead exposed; and forming a solder mask on the encapsulation, on the first lead, and on the second lead with the first external conductive layer and the second external conductive layer exposed from the solder mask.