Multi-row Wiring Member for Semiconductor Device
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Solution Overview
Problem
Conventional semiconductor device manufacturing processes face challenges in achieving a reliable resin-sealed semiconductor device with reduced thickness and size, improved adhesion between plating films and resin, uniform terminal surface height, and elimination of steps like metal sheet removal by etching and forming openings for external terminals, while also addressing warpage and moisture issues during mass production.
Innovation Solution
A multi-row wiring member configuration featuring a permanent resist with uncovered lower faces for internal terminals, connected wiring portions, and uncovered upper faces for external terminals, forming an L or inverted T shape, along with a metal frame portion around the aggregate of wiring members to enhance strength and adhesion, and a manufacturing method that eliminates the need for metal sheet removal and opening formation, using a series of resist masks and plating layers to achieve these features.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional substrate structures with metal sheets and multiple plating layers are used, then terminal portions can be formed with internal and external faces, but the manufacturing process requires multiple steps including etching to remove metal sheets and forming openings, increasing process complexity
Solution Approach 1:
The invention extracts and eliminates the metal sheet base material from the conventional substrate structure. By forming the wiring member directly on a resin sheet without a metal sheet base, the patent removes the need for etching steps to remove metal sheets and forming openings, thereby simplifying the manufacturing process while maintaining terminal portion functionality
Solution Approach 2:
The invention performs preliminary actions by pre-forming the wiring member structure with internal terminals, wiring portions, and external terminals directly on the resin sheet before sealing. The L-shaped or inverted T-shaped configuration is established in advance, eliminating the need for subsequent etching and opening formation steps
2Device complexity
If the wiring member structure is simplified to reduce manufacturing steps, then process complexity decreases, but adhesion between plating films and resin may be compromised
Solution Approach 1:
The invention uses composite material structures by forming multiple plating layers (first plating layer for internal terminals, second plating layer for external terminals, and wiring portions connecting them) directly on the resin sheet. This composite structure of plating layers and resin provides both structural integrity and strong adhesion, ensuring reliability while maintaining process simplicity
3Productivity
If conventional substrates are used for mass production, then production volume can be achieved, but warpage and moisture issues occur during manufacturing
Solution Approach 1:
The invention changes the fundamental parameter of the substrate structure by eliminating the metal sheet base material and using only a resin sheet as the foundation. This parameter change prevents warpage issues associated with metal sheets and eliminates moisture penetration problems, while still enabling mass production through the simplified wiring member formation process
4Reliability
If terminal portions are formed with both internal and external faces using conventional methods, then electrical connection functionality is achieved, but the device thickness increases
Solution Approach 1:
The invention transitions from a conventional multi-layer stacked structure (metal sheet base + multiple plating layers) to a planar configuration where internal terminals, wiring portions, and external terminals are formed in the same plane on the resin sheet. The L-shaped or inverted T-shaped wiring portions extend laterally rather than vertically, reducing device thickness while maintaining electrical connection functionality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the production of highly-reliable, resin-sealed semiconductor devices with improved adhesion, reduced thickness, and minimized manufacturing steps, while preventing warpage and moisture-related issues, ensuring high yield and reliability in mass production.
Implementation Method 1
a first plating layer, which is to become internal terminals, formed in a permanent resist with lower faces thereof being uncovered at predetermined sites in a bottom surface of the permanent resist; a plating layer that is to become wiring portions, connected with the first plating layer in the permanent resist; and a second plating layer, which is to become external terminals, formed in the permanent resist on partial areas within areas of the plating layer that is to become wiring portions
Data Source
AI summary
A multi-row wiring member for semiconductor device configured of a plurality of wiring members arrayed in a matrix includes a permanent resist, a first plating layer forming internal terminals, a plating layer forming wiring portions and a second plating layer forming external terminals. The first plating layer is formed in the permanent resist with lower faces thereof uncovered in the bottom surface of the permanent resist. The plating layer forming wiring portions is formed on the first plating layer in the permanent resist. The second plating layer is formed in the permanent resist on partial areas within areas of the plating layer forming wiring portions, with upper faces thereof being uncovered on a top-surface side of the permanent resist. On a bottom-surface side of the permanent resist, a metal frame is formed at the margin around an aggregate of individual wiring members for semiconductor devices arrayed in a matrix.