Multi-Segment Edge Ring Removal Without Chamber Venting
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Solution Overview
Problem
The existing methods for replacing edge rings and support rings in processing chambers, such as those used in semiconductor processing, are time-consuming and require venting the chamber, leading to inefficiencies and increased costs due to the need for extensive cleaning and pumping down.
Innovation Solution
A multi-segment edge ring system and associated methods that allow for the replacement of these rings without venting the processing chamber, using a robot blade and carrier plate to elevate and separate the rings for removal through a substrate access port, enabling automated swapping of consumable parts while maintaining vacuum pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional methods are used to replace edge rings by opening the processing chamber, then operators can access and replace the rings, but the chamber must be vented and cleaned extensively, resulting in downtime of up to twenty-four hours
Solution Approach 1:
The edge ring is divided into multiple separable segments that can be independently removed and replaced. This segmentation allows the ring to be disassembled into smaller pieces that can be extracted through the substrate access port without requiring full chamber opening, thereby reducing downtime while maintaining ease of replacement
Solution Approach 2:
A robot blade with carrier plate is introduced as an intermediary tool to facilitate ring removal. The robot blade inserts through the substrate access port and uses the carrier plate to support and extract the ring segments, enabling replacement without venting the chamber
2Ease of operation
If the processing chamber is opened for ring replacement, then direct access to the rings is achieved, but extensive cleaning and pumping down are required, increasing overall process time
Solution Approach 1:
The ring segments are extracted through the substrate access port using the robot blade and carrier plate, removing the need to open the processing chamber. This extraction approach maintains chamber vacuum integrity and eliminates the time-consuming cleaning and pumping down steps
Solution Approach 2:
The system uses automated robotic manipulation for ring removal and replacement, reducing manual intervention requirements. The multi-segment design allows segments to be easily separated and reassembled, enabling quick swaps that maintain high processing efficiency
3Manufacturing precision
If a complete edge ring is used, then process uniformity is maintained, but the entire ring must be replaced even if only partially worn, increasing waste and cost
Solution Approach 1:
The edge ring is divided into multiple segments that can be independently inspected and replaced. Only the worn segments need to be replaced rather than the entire ring, reducing material waste while maintaining process uniformity through precise segment fabrication
Solution Approach 2:
Worn ring segments are discarded and replaced, while the remaining functional segments are retained and reused. This selective replacement approach recovers usable portions of the original ring structure, reducing overall material consumption and cost
Data Source
AI summary
A method and apparatus for replacing process kits that include edge rings and/or support rings in processing chambers. In one implementation, a process kit comprises a multi-segment edge ring. The multi-segment edge ring comprises a first segment, a second segment, and a first annular body. The first annular body comprises a first upper surface, a first lower surface opposite the first upper surface, a first inner surface and a first outer surface. The first segment and the second segment are connectable to form the first annular body. The first lower surface is operable to be positioned over a substrate support disposed within a processing chamber, and at least a portion of the inner surface, which is positioned between the first upper surface and the first lower surface has a diameter greater than a diameter of a substrate to be processed in the processing chamber.