Multi-segment Heat-shrinkable Film for Meat Packaging

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Solution Overview

Problem

Conventional multi-segment heat-shrinkable films used for packaging fresh foods, particularly bone-in meat, face challenges in achieving high degrees of free shrink and tight fit due to limitations in oxygen barrier materials and puncture resistance, especially when exposed to ionizing radiation.

Innovation Solution

A multi-segment film structure comprising a bulk layer and a microlayer section with a high ratio of microlayer thickness to bulk layer thickness, combined with an oxygen barrier segment, is developed to enhance free shrink and compression, achieved through a coextrusion process and orientation techniques.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If ionizing radiation is used to induce cross-linking for puncture resistance, then film strength improves, but oxygen-barrier materials degrade

Engineering Contradiction:
Improvepuncture resistanceVSAvoidoxygen barrier performance
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The film is divided into multiple segments with distinct functions: a first segment containing cross-linkable polymer for puncture resistance, and a second segment containing oxygen-barrier material. This segmentation allows each segment to be optimized for its specific function without compromising the other.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the film have different properties: the first segment is designed for mechanical strength and cross-linking, while the second segment is designed for oxygen barrier performance. This local differentiation resolves the contradiction by assigning specific qualities to specific locations.

Inventive Principle:
Principle #3Local quality

2Shape

If multi-segment films are oriented to achieve high compression, then tight fit improves, but free shrink degree decreases

Engineering Contradiction:
Improvetight fitVSAvoidfree shrink
Core Design Contradiction:
ShapeVSLength of moving object

Solution Approach 1:

The patent optimizes the thickness ratio parameter of microlayers to bulk layers (at least 1:2) and the number of microlayers (at least 10) to achieve a balance between compression and free shrink. By changing these structural parameters, the film achieves both tight fit and adequate shrinkage.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The film exhibits a total free shrink of at least 30% at 85°C, providing a tighter package and minimizing meat purge, while maintaining an oxygen transmission rate below 100 cc/m²-atm-24 hrs, thus addressing the need for improved packaging films.

Implementation Method 1

which have been heated to their flow or melting point from an extrusion or coextrusion die

Methodology Applied
Scientific EffectHeating: Heating

Implementation Method 2

An oriented (i.e., heat-shrinkable) material will tend to return to its original unstretched (unextended) dimensions when heated to an appropriate elevated temperature

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentEP2654992B1Multi-segment, heat-shrinkable barrier film comprising a plurality of microlayers
Publication Date: 2016.03.23 CRYOVAC INC
  • EP2654992B1 patent drawingFigure 1
  • EP2654992B1 patent drawingFigure 2
  • EP2654992B1 patent drawingFigure 3~4

AI summary

A multi-segment, heat-shhnkable film includes a first segment and a second segment. The first segment includes a bulk layer and a microlayer section comprising a plurality of microlayers. The second segment is joined to the first segment and has an oxygen transmission rate of no more than about 100 cc/m2-atm.-24 hrs. (at 73°F and 0% relative humidity). The multi-segment film has a total free shrink (ASTM D2732-08) of at least about 30% at 185°F.