Multi-Sensor Chip Package Synchronization for 3D Imaging
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Solution Overview
Problem
The increasing demand for high-quality image generation in devices like cameras and smartphones, particularly for three-dimensional imaging, is hindered by the need for multiple image sensor chips, which increases manufacturing costs and complicates synchronization due to long distances between chips, leading to potential transmission delays and reduced image quality.
Innovation Solution
A system with multiple image sensors integrated into a single semiconductor chip package or connected via optical fibers, featuring a controller for synchronized exposure control using a shared clock signal, and an image synthesis unit for generating high dynamic range or three-dimensional images.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple image sensor chips are used to generate multiple image sensor signals simultaneously, then image quality and three-dimensional imaging capability are improved, but manufacturing cost increases and device size increases
Solution Approach 1:
The patent combines multiple image sensor chips (first and second image sensor chips) into a single integrated package, merging previously separate components into one unified device. This reduces the total number of discrete chips needed, lowering manufacturing complexity and cost while maintaining the capability to generate multiple image sensor signals simultaneously for high-quality imaging and three-dimensional imaging
2Adaptability or versatility
If multiple image sensor chips are placed at different spatial positions, then three-dimensional imaging capability is improved, but transmission delay increases due to long cable distances
Solution Approach 1:
The patent merges multiple image sensor chips into one integrated package with internal signal transmission paths, eliminating the need for long external cables. This reduces transmission delay significantly while maintaining the spatial arrangement necessary for three-dimensional imaging capability
3Manufacturing precision
If multiple image sensor chips are used, then image quality and three-dimensional imaging are improved, but device miniaturization becomes more difficult
Solution Approach 1:
The patent combines multiple image sensor chips and their associated circuitry into a single integrated package, reducing the overall device volume. By merging separate components into one unified structure, the patent enables miniaturization while maintaining the capability to generate multiple image sensor signals for high-quality imaging and three-dimensional imaging
4Adaptability or versatility
If image sensor chips are positioned at long distances apart, then compound field of view coverage is improved, but synchronization control becomes more difficult
Solution Approach 1:
The patent integrates multiple image sensor chips with a controller in one package, enabling precise synchronization control through internal signal paths. The controller can coordinate the first and second image sensors to capture images from different fields of view simultaneously, maintaining synchronization accuracy while achieving compound field of view coverage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs, minimizes space requirements, and ensures precise synchronization of image sensor signals, enabling the creation of high-quality single and compound field of view images while maintaining compact device designs.
Implementation Method 1
at least one of the semiconductor chip packages has an optical fiber interface; and a controller for controlling the plurality of image sensors to operate in coordination through an optical control signal transmitted on an optical fiber
Data Source
AI summary
Provided is a system with image sensors combination, including: a plurality of image sensors located in a same semiconductor chip package; and a controller for controlling the plurality of image sensors to operate in coordination, wherein each image sensor includes: a plurality of photosensitive pixel cells to be simultaneously exposed to generate analog photosensitive signals; an analog-to-digital converters for converting the analog photosensitive signals generated by the plurality of photosensitive pixel cells into image sensor signals; and a timing circuit for controlling the generation, readout, and transmission of electrical signals.