Multi-Sensor Inspection Apparatus for Semiconductor Substrate Defect Detection
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Solution Overview
Problem
The increasing complexity of semiconductor fabrication processes requires more efficient substrate inspection methods to detect defects effectively, particularly in terms of image processing speed and light quantity, which existing technologies have not adequately addressed.
Innovation Solution
An inspection apparatus is designed with a stage, objective lens, ocular lens, and multiple sensors arranged in the image plane to enhance optical enlargement and detection of substrate images, utilizing a control module to process image signals from multiple sensors independently, thereby increasing image processing speed and light quantity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single sensor is used to inspect the substrate, then the device complexity is low, but the image processing speed is slow and the quantity of reflected light is insufficient
Solution Approach 1:
The inspection apparatus divides the sensing function into multiple independent sensors arranged in the image plane. Each sensor processes a specific region of the enlarged substrate image, enabling parallel processing that increases overall inspection speed while maintaining manageable individual sensor complexity
Solution Approach 2:
The patent transitions from a single-point inspection approach to a multi-point simultaneous inspection by arranging sensors across the image plane. This spatial distribution in the image plane dimension enables parallel detection of multiple regions, significantly improving processing speed without proportionally increasing system complexity
2Measurement precision
If the quantity of reflected light is increased to improve detection accuracy, then the measurement precision improves, but the device complexity increases due to additional optical components
Solution Approach 1:
The patent combines multiple sensors to collectively capture and process reflected light from the substrate. By merging the detection capabilities of multiple sensors in the image plane, the system achieves higher measurement precision through increased light collection and parallel processing without requiring complex individual optical paths for each sensor
Solution Approach 2:
The optical system is designed with universal components that serve multiple sensors simultaneously. The objective lens and light source serve all sensors in the image plane, creating a multi-functional system where single optical elements perform multiple detection functions, thereby improving precision without proportionally increasing complexity
3Speed
If multiple sensors are arranged in the image plane to increase processing speed, then the image processing speed increases, but the sensors may overlap causing image distortion
Solution Approach 1:
The patent applies local quality by assigning specific detection regions to each sensor in the image plane. Each sensor is optimized for its specific location and captures light from a particular area of the enlarged substrate image, ensuring accurate local detection while maintaining overall image fidelity through coordinated sensor responses
Solution Approach 2:
The system incorporates feedback mechanisms where the control module receives signals from multiple sensors and processes them to correct for any overlapping or distortion effects. This feedback processing ensures that the final defect detection maintains manufacturing precision even when sensors are closely arranged to maximize processing speed
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables faster and more accurate detection of defects on semiconductor substrates by maximizing the quantity of reflected light and reducing image distortion, allowing for improved manufacturing processes based on real-time inspection data.
Implementation Method 1
an objective lens on the stage and configured to enlarge the substrate optically
Implementation Method 2
an ocular lens on the objective lens and configured to form at its image plane an image of the enlarged substrate
Implementation Method 3
an inspection apparatus may optically detect defects on a substrate
Implementation Method 4
a plurality of sensors above the ocular lens and in the image plane of the ocular lens
Data Source
AI summary
Disclosed are an inspection apparatus and a method of manufacturing a semiconductor device using the same. The inspection apparatus includes a stage configured to receive a substrate, an objective lens on the stage and configured to enlarge the substrate optically, an ocular lens on the objective lens and configured to form at its image plane an image of the substrate, and a plurality of sensors above the ocular lens and in the image plane of the ocular lens.