Multi-Sensor Chip Package With Open Housing to Reduce Stress
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Solution Overview
Problem
Existing sensor devices face challenges in packaging that expose them to mechanical stresses, require complex geometries, and are costly due to chip-to-chip bonding and wire bonding, especially for multi-sensor systems, which affect performance and increase production costs.
Innovation Solution
A sensor component design featuring a chip carrier with multiple semiconductor chips, where sensor elements are integrated within a housing formed by a potting compound with an opening, using film-assisted molding to ensure interaction with the atmosphere, and optionally covered by a gel layer, while bonding wires are encapsulated.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If sensor elements are exposed to interact with the surrounding medium, then measurement capability is improved, but mechanical stresses from packaging are introduced affecting sensor performance
Solution Approach 1:
The housing is segmented into a first housing part and a second housing part that can be separated from each other. This allows the sensor chip to be accessed and removed without complete encapsulation, enabling measurement functionality while reducing mechanical stress constraints during packaging.
Solution Approach 2:
The sensor chip is extracted from complete encapsulation by providing access openings in the housing. The sensor element remains exposed through these openings to interact with the surrounding medium, while the housing provides protection from other environmental factors.
2Area of stationary object
If multiple sensor chips are integrated in a compact arrangement, then space utilization is improved, but production complexity increases due to chip-to-chip bonding
Solution Approach 1:
Multiple sensor chips are mounted side-by-side on a single chip carrier in a planar arrangement. This merging approach consolidates multiple sensors into one package without requiring complex chip-to-chip bonding, simplifying production while maximizing space utilization.
Solution Approach 2:
The complex chip-to-chip bonding process is extracted/replaced by a simpler mounting approach where all chips are attached to a common carrier substrate, eliminating the need for intricate inter-chip connections.
3Object-affected harmful factors
If complete encapsulation is used for protection, then environmental protection is improved, but sensor access to surrounding medium is blocked
Solution Approach 1:
The housing is divided into separable parts with access openings that allow sensor elements to remain exposed to the surrounding medium while other portions of the housing provide environmental protection.
Solution Approach 2:
The housing provides selective protection: areas where sensors need to interact with the medium are left open, while other areas provide encapsulation and protection from environmental factors. This local differentiation of quality allows simultaneous protection and access.
4Object-affected harmful factors
If complex housing geometries are used to protect sensors, then protection capability is improved, but manufacturing costs increase
Solution Approach 1:
The housing is segmented into simple geometric parts (first housing part and second housing part) that can be manufactured separately using standard processes and then assembled, reducing manufacturing complexity and cost while maintaining protection capability.
Data Source
AI summary
An integrated sensor component includes a chip carrier and a first semiconductor chip and a second semiconductor chip, wherein either both semiconductor chips are arranged on the chip carrier or (alternatively) the second semiconductor chip is arranged on the chip carrier and the first semiconductor chip is arranged on the second semiconductor chip (chip-on-chip). The integrated sensor component further includes a first sensor element integrated in the first semiconductor chip and a second sensor element integrated in the second semiconductor chip, as well as a housing formed by a potting compound, which has an opening. Both the first sensor element and the second sensor element are located within the opening so that they can interact with the atmosphere surrounding the sensor component.