Multi-Side Circuit Layer Layout for Uniform Display Brightness
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Solution Overview
Problem
The excessive gathering of signal lines and/or power lines on a single side of a substrate in electronic devices leads to uneven current distribution, heat accumulation, and power dissipation, affecting the quality of the displayed image, such as uneven image brightness.
Innovation Solution
The electronic device is designed with a circuit layer where the width of the second wirings differs from the first wirings, allowing for a more uniform distribution of power signals and reducing heat accumulation by dispersing power signals through multiple side circuits on multiple sides of the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If signal lines and power lines are arranged on the same side of the substrate to save space, then space utilization is improved, but uneven current distribution and heat accumulation occur
Solution Approach 1:
The patent segments the circuit layer into multiple sides of the substrate, distributing signal lines and power lines across different sides rather than concentrating them on one side. This spatial segmentation reduces current density and heat accumulation in any single region while maintaining efficient space utilization throughout the device.
Solution Approach 2:
The patent transitions from a two-dimensional arrangement (all lines on one side) to a three-dimensional distribution (lines on multiple sides of the substrate). This dimensional change allows for better heat dissipation and current distribution while preserving space efficiency.
2Area of stationary object
If signal lines and power lines are arranged on the same side of the substrate to save space, then space utilization is improved, but uneven image brightness occurs
Solution Approach 1:
By segmenting the circuit connections across multiple sides of the substrate, the patent ensures more uniform power and signal distribution to the display elements. This eliminates the uneven current distribution that causes brightness non-uniformity while maintaining compact space utilization.
3Temperature
If multiple side circuits are used to disperse power signals, then heat accumulation is reduced, but device complexity increases
Solution Approach 1:
The patent merges the functions of multiple side circuits into a unified multi-side circuit layer architecture. While the circuit is distributed across multiple sides to reduce heat accumulation, the design integrates these circuits systematically, maintaining manufacturing feasibility and avoiding excessive complexity through standardized circuit layer construction.
Data Source
AI summary
An electronic device is provided. The electronic device includes a substrate, an electronic unit, and a circuit layer. The substrate has a first surface and a second surface, and the second surface is opposite the first surface. The electronic unit is disposed on the first surface. The circuit layer is disposed on the second surface. The circuit layer includes a plurality of first wirings and a plurality of second wirings. The plurality of first wirings are used to transmit a first signal. The plurality of second wirings are used to transmit a second signal. Moreover, a width of one of the plurality of second wirings is different from a width of one of the plurality of first wirings.