Multi-sided Heat Sink PCB Module for Compact Thermal Management

The patent combines the heat radiation function with the PCB substrate itself by integrating heat radiation plates into the PCB layers. The heat radiation plates are embedded within the PCB structure and thermally connected to circuit patterns through thermal conduction paths, eliminating the need for separate surface-mounted heat radiation structures. This merging approach maintains heat discharge capability while reducing structural complexity and volume.

The patent transitions from two-dimensional surface heat radiation to three-dimensional internal heat radiation by placing heat radiation plates within the PCB layers. Heat is radiated from multiple internal surfaces in different directions (upward, downward, and laterally) rather than from a single surface plane, enabling effective heat discharge without increasing external dimensions or adding surface-mounted components.

The patent divides the heat radiation function across multiple segments within the PCB stack. Each PCB layer contains heat radiation plates that independently radiate heat from their respective positions. This segmentation allows heat from internal circuit patterns to be discharged at multiple levels and locations within the multilayer structure, preventing heat accumulation while maintaining high circuit integration.

The patent introduces heat radiation plates as intermediary elements between circuit patterns and the external environment. These plates are thermally coupled to circuit patterns through thermal conduction paths and radiate heat in multiple directions, serving as mediators that efficiently transfer heat from internal circuits to the surroundings without requiring the circuits themselves to be exposed on the surface.

The patent merges the heat radiation function with the existing PCB structure by embedding heat radiation plates within the PCB layers. This eliminates the need for additional external heat radiation structures, maintaining heat discharge efficiency while avoiding any increase in module volume. The heat radiation plates utilize the same space already occupied by the PCB.

The patent nests heat radiation plates within the PCB layers, similar to nested dolls. The heat radiation plates are positioned inside the PCB structure rather than being attached externally, allowing the heat radiation function to be contained within the existing volume. This nesting approach enables effective heat discharge without increasing the overall module dimensions.