Multi-Sided Light-Emitting Circuit Board for Higher Light Efficiency
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing light-emitting chip packaging technologies result in single-sided light emission, leading to low light efficiency due to the use of a single light emitting surface and complex packaging processes.
Innovation Solution
A method for manufacturing a multi-sided light-emitting circuit board involves a copper-clad substrate with a transparent substrate and conductive circuit layers, where light-emitting chips with two electrodes are placed in accommodating spaces between metal pieces, and a conductive paste is used for electrical connection, followed by reflow soldering and encapsulation to enhance light emission from multiple sides.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If single-sided light-emitting chips are mounted on heat sink substrate through flip-chip packaging, then packaging reliability is improved, but light-emitting area is limited to one side resulting in low light efficiency
Solution Approach 1:
The patent transitions from single-sided (2D) light emission to multi-sided (3D) light emission by mounting light-emitting chips on the side walls of metal pieces. The chips are arranged to emit light in multiple directions (front, side, and bottom), effectively utilizing three-dimensional space for light output and dramatically increasing the light-emitting area.
2Manufacturing precision
If complex sink-bottom transfer process is used to convert vertical structure to flip-chip structure, then packaging precision is improved, but manufacturing complexity increases and costs rise
Solution Approach 1:
Instead of mounting chips on the bottom surface (traditional flip-chip approach), the patent inverts the mounting location to the side walls of metal pieces. This inversion simplifies the packaging process by eliminating the need for complex sink-bottom transfer operations while maintaining reliable electrical and mechanical connections through the metal pieces.
3Ease of manufacture
If light-emitting chips are mounted on heat sink substrate with single light emitting surface, then ease of manufacture is improved, but light efficiency is reduced
Solution Approach 1:
The patent employs multi-sided mounting of light-emitting chips on metal piece side walls, enabling light emission from multiple surfaces (front, side, and bottom) simultaneously. This three-dimensional light emission configuration dramatically increases light efficiency while maintaining manufacturing simplicity through standardized circuit board processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs, decreases the distance between light-emitting chips, and increases the light-emitting area, thereby improving light efficiency by allowing light to be emitted from all sides.
Implementation Method 1
performing a reflow soldering step, so that the light-emitting chip and the conductive paste are electrically connected
Implementation Method 2
Forming an encapsulant layer on a surface of the first conductive circuit layer, the encapsulant layer encapsulating the metal pieces and the light-emitting chips
Data Source
AI summary
The present invention relates to a multi-sided light-emitting circuit board, which includes: a transparent substrate layer and a first conductive circuit layer on at least one surface of the transparent substrate layer. The first conductive circuit layer includes conductive portions arranged at intervals. A metal piece is formed on a surface of each conductive portion away from the transparent substrate layer. An accommodation space is formed between adjacent metal pieces. The accommodation space is provided with a light-emitting chip. Each light-emitting chip includes two electrodes. The two electrodes are respectively located at opposite ends of the light-emitting chip. The electrodes are respectively electrically connected to adjacent metal pieces. An encapsulant layer is formed on a surface of the first conductive circuit layer. The encapsulant layer covers and encapsulates the metal pieces and the light-emitting chips. The invention also relates to a method for manufacturing a multi-faceted light-emitting circuit board.