Multi-site Semiconductor Test Frame Configuration
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Solution Overview
Problem
Existing methods for testing singulated semiconductor devices are inefficient, as they typically involve single-site testing, which is time-consuming and costly, and do not optimize the placement and testing configuration to minimize costs or enhance probe utilization.
Innovation Solution
A system and method for multi-site placement of singulated semiconductor devices, which determines an optimal test configuration using a data processing device to arrange devices in a test frame, optimizing spacing and probe configuration to minimize costs and enhance testing efficiency, allowing for simultaneous electrical testing of multiple devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If single-site testing is used for singulated semiconductor devices, then testing can be performed with simple equipment, but testing time and cost increase significantly
Solution Approach 1:
The patent combines multiple test sites into a single test frame, allowing multiple semiconductor devices to be tested simultaneously. The test frame includes multiple contact pads arranged in a grid pattern that can electrically connect to multiple devices at once, merging several single-site testing operations into one parallel multi-site testing operation, thereby improving productivity without requiring proportionally more complex equipment
Solution Approach 2:
The patent transitions from single-site (one-dimensional) testing to multi-site (two-dimensional) testing by arranging contact pads in a grid pattern across the test frame. This dimensional expansion allows simultaneous testing of multiple devices across the frame, transforming the testing approach from sequential to parallel operation and significantly improving testing efficiency
2Productivity
If multi-site testing is implemented, then testing efficiency improves, but placement and configuration complexity increases
Solution Approach 1:
The patent segments the test frame into multiple independent contact pads arranged in a systematic grid pattern, where each pad can independently contact a semiconductor device. This segmentation allows for standardized, repeatable placement configurations that reduce complexity by providing a modular approach to multi-site testing setup
Solution Approach 2:
The patent employs automated parameter optimization to determine the optimal arrangement of contact pads and semiconductor devices on the test frame. By using data processing to calculate and adjust parameters such as pad spacing, device positioning, and contact alignment, the system automatically resolves placement complexity and generates optimized configurations that maximize testing efficiency
3Productivity
If optimal test configuration is determined through data processing, then testing cost is minimized, but computational time and processing requirements increase
Solution Approach 1:
The patent performs preliminary computational analysis to determine the optimal test configuration before actual semiconductor device testing begins. By pre-calculating the optimal arrangement of contact pads and devices, and pre-determining the most cost-effective testing parameters, the system minimizes real-time computational requirements and reduces overall testing time and cost
Solution Approach 2:
The patent implements an iterative optimization process where initial test configurations are evaluated based on cost and efficiency metrics, and adjustments are made based on feedback from previous testing cycles. This feedback mechanism allows the system to converge on optimal configurations through repeated refinement, balancing computational effort with cost minimization
Data Source
AI summary
Systems and methods for multi-site placement of singulated semiconductor devices are presented. The systems and methods for multi-site placement may facilitate multi-site testing of the singulated semiconductor devices. A method may include determining a quantity of singulated semiconductor devices to be arranged in a test configuration. The method may also include determining, using a data processing device, a test configuration in response to the quantity. In further embodiments, the method may include placing the singulated semiconductor devices in a test frame according to the test configuration.