Multi-Slit Upper Cone Epitaxy Chamber Airflow Control
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Solution Overview
Problem
In high growth rate epitaxy chambers, coatings on the upper dome can form due to non-uniform temperatures, blocking light irradiation and causing slip dislocations on the substrate, which compromises the uniformity of the film formed.
Innovation Solution
A multi-slit upper cone with a partial cylindrical and conical design is used in the epitaxy chamber, featuring multiple slits that allow for controlled airflow to reduce temperature variations on the upper dome, preventing deposition and ensuring uniform substrate temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single-slit cone is used to control airflow, then the structure is simple and easy to manufacture, but temperature uniformity on the upper dome deteriorates leading to coating formation
Solution Approach 1:
The single slit in the prior art cone is divided into multiple slits arranged in specific patterns. This segmentation allows different regions of the upper dome to receive controlled airflow, creating targeted cooling zones that eliminate hot spots and prevent coating formation while maintaining manufacturing simplicity.
Solution Approach 2:
Different slits are positioned at specific locations on the cone to provide localized cooling where needed. The slit configuration creates non-uniform airflow distribution that specifically addresses temperature variations in different regions of the upper dome, applying cooling precisely where temperature uniformity is needed.
2Temperature
If airflow is increased to cool the upper dome, then temperature uniformity improves, but deposition on the upper dome worsens due to non-uniform cooling
Solution Approach 1:
The multiple slits are strategically positioned to segment the airflow into controlled streams that distribute cooling uniformly across the upper dome surface. This prevents localized over-cooling that would cause deposition while still achieving overall temperature uniformity through balanced airflow distribution.
Solution Approach 2:
The slit configuration is designed to create equipotential temperature distribution on the upper dome by distributing airflow to equalize temperature across the surface. This prevents temperature gradients that would otherwise cause material deposition in cooler regions.
3Object-generated harmful factors
If a multi-slit upper cone is used to improve temperature uniformity, then deposition is reduced, but device complexity increases
Solution Approach 1:
The cone is segmented into multiple sections with slits at different positions and orientations. This segmentation enables independent control of airflow to different regions, reducing deposition through targeted cooling while the modular slit design keeps manufacturing complexity manageable.
4Temperature
If cooling airflow is applied to the upper dome, then high temperature areas are reduced, but light irradiation is blocked causing slip dislocations
Solution Approach 1:
The slits are positioned and sized to segment the cooling airflow into controlled streams that cool the upper dome without creating dense vapor zones that would block light. The segmented airflow pattern allows temperature control while maintaining light transmission paths to the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multi-slit upper cone improves airflow and temperature uniformity across the upper dome, reducing the likelihood of deposition and enhancing the uniformity of the film formed on the substrate by strategically placing slits to manage airflow and temperature.
Implementation Method 1
air flow through the multi-slit upper cone improves airflow and temperature uniformity across the upper dome
Implementation Method 2
the single slit 32 of the cone 30 is placed beneath a pyrometer to allow passage of infrared waves through the single slit 32 of the cone 30
Data Source
AI summary
An epitaxial deposition chamber having an upper cone for controlling air flow above a dome in the chamber, such as a high growth rate epitaxy chamber, is described herein. The upper cone has first and second components separated by two or more gaps in the chamber, each component having a partial cylindrical region having a first concave inner surface, a first convex outer surface, and a fixed radius of curvature of the first concave inner surface, and a partial conical region extending from the partial cylindrical region, the partial conical region having a second concave inner surface, a second convex outer surface, and a varying radius of curvature of the second concave inner surface, wherein the second concave inner surface extends from the partial cylindrical region to a second radius of curvature less than the fixed radius of curvature.