Multi-SoC Thermal Coordination via Inter-SoC Communication
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Solution Overview
Problem
User devices with multiple System-on-a-Chip (SoC) components face challenges in coordinating the detection and recovery from thermal critical conditions, as each SoC may have internal temperature sensors inaccessible to other SoCs, leading to inefficient cooling and potential device malfunction.
Innovation Solution
Implement a communication interface between SoCs to share thermal critical condition indicators, allowing one SoC to reset and reboot based on temperature data from another SoC, using virtual analog-to-digital converters to monitor temperature sensors and coordinate cooling processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If each SoC monitors its own internal temperature sensors independently, then each SoC can detect its own thermal conditions, but other SoCs cannot detect thermal conditions of the first SoC, leading to incomplete thermal management
Solution Approach 1:
The patent introduces an intermediary mechanism (interface between SoCs) that allows thermal condition information to be shared across different SoC components. When one SoC detects a thermal critical condition through its internal temperature sensor, it communicates this information to other SoCs via the interface, enabling comprehensive system-wide thermal management without requiring each SoC to directly access other SoC's internal sensors.
2Reliability
If multiple SoCs coordinate resetting based on shared thermal information, then complete thermal recovery can be achieved, but coordination complexity between SoCs increases
Solution Approach 1:
The patent merges the thermal management functions across multiple SoCs by implementing a unified coordination mechanism. Instead of each SoC operating independently, the system combines their thermal detection and response capabilities through the interface, allowing coordinated resetting operations that ensure complete thermal recovery while managing complexity through standardized interaction protocols.
3Loss of information
If virtual analog-to-digital converters are used to monitor temperature sensors across SoCs, then thermal data can be shared, but the system requires additional conversion infrastructure
Solution Approach 1:
The patent implements virtual analog-to-digital converters that serve multiple functions: they not only convert temperature sensor signals for sharing across SoC boundaries but also integrate with the existing thermal management infrastructure. This multi-functional approach allows thermal data accessibility without requiring completely separate conversion infrastructure for each SoC.
Data Source
AI summary
Techniques for identifying thermal critical conditions in devices with multiple SoCs, and coordinating the resetting and rebooting of the SoCs to recover from the thermal critical conditions are described herein. A device may include a first SoC that monitors a first temperature sensor, and a second SoC that monitors a second temperature sensor, to determine whether temperatures in the device indicate thermal critical conditions. The second SoC may determine that a temperature determined using the second temperature sensor is above a threshold indicating a thermal critical condition, and may provide an indication to the first SoC that the temperature is above the threshold. The first SoC may detect the indication, and the first SoC and second SoC may each reset to allow the device to cool down. The first SoC and second SoC may then coordinate rebooting once the thermal critical condition is no longer detected in the device.