Multi-Stack Semiconductor Device With Segmented Inductive Coils
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Solution Overview
Problem
The existing multi-stack semiconductor integrated circuit devices face challenges in efficient communication between semiconductor chips with high power consumption due to the need for multiple data transfers and interference from eddy currents, which increases power requirements and reduces magnetic field effectiveness, while also incurring extra costs for coil formation and parasitic capacitance.
Innovation Solution
The implementation of a multi-stack semiconductor integrated circuit device with two types of coils for transmission/reception - a larger coil for long-distance communication and a smaller polygonal coil for short-distance communication, allowing for efficient data transfer by bypassing multiple chips and reducing power consumption, along with a spiral step form stacking structure to minimize coil size and height, and using diagonal coils to reduce interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a single large coil is used for long-distance communication between stacked chips, then communication distance is improved, but power consumption increases due to eddy current interference and multiple data transfers are required
Solution Approach 1:
The patent divides the communication system into multiple coils of different sizes (large coil for long-distance communication, small coil for short-distance communication) rather than using a single coil. This segmentation allows the system to select the appropriate coil size based on communication distance, reducing power consumption by using the smaller coil when possible and avoiding eddy current interference from unnecessarily large coils.
Solution Approach 2:
The patent applies different coil sizes at different locations in the stack - larger coils are used where long-distance communication is needed, while smaller coils are used for adjacent chip communication. This local differentiation optimizes power consumption by matching coil size to actual communication requirements at each location.
2Reliability
If multiple data transfers are performed to communicate between distant chips, then communication reliability is improved, but power consumption and time delay increase
Solution Approach 1:
The patent segments the communication path into direct long-distance links using large coils and short-distance links using small coils. This allows data to be transmitted directly across multiple chip distances in a single transfer when using large coils, rather than requiring multiple sequential transfers through intermediate chips, thereby reducing total power consumption while maintaining reliability.
3Length of stationary object
If coil size is increased to extend communication distance, then communication range is improved, but parasitic capacitance and manufacturing cost increase
Solution Approach 1:
The patent uses multiple coils of different sizes rather than one excessively large coil. This segmentation allows the system to achieve long communication distances through strategic placement of appropriately-sized coils, minimizing parasitic capacitance by using the smallest necessary coil size for each communication link.
4Speed
If wires are used for data communication between stacked chips, then communication speed is improved, but the number of bonding wires becomes tremendous, restricting the number of chips that can be stacked
Solution Approach 1:
The patent replaces the mechanical bonding wire system with an electromagnetic field-based wireless communication system using inductive coupling between coils. This substitution eliminates the need for numerous physical bonding wires connecting each chip pair, allowing many more chips to be stacked while maintaining communication capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient communication between semiconductor chips with reduced power consumption, lower operational costs, and minimized parasitic capacitance, achieving a lower power ratio for data transfer within the SSD system compared to prior art.
Implementation Method 1
communication is carried out between IC chips that are stacked on top of each other through inductive coupling via coils formed of wires on the chips
Implementation Method 2
data to be sent and received between a number of IC chips through wireless communication
Data Source
AI summary
The invention relates to a multi-stack semiconductor integrated circuit device where communication between semiconductor chips can be efficiently carried out by bypassing a number of chips. Each semiconductor chip that forms a multi-stack semiconductor integrated circuit device having a stack structure where four or more semiconductor chips having the same shape are stacked on top of each other is provided with: a first coil for transmission/reception for communication between chips over a long distance; and a second coil for transmission/reception for communication between chips over a short distance, of which the size is smaller than that of the above-described first coil for transmission/reception.