Multi-Stacking Carrier Structure for Wafer Thinning Analysis
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Solution Overview
Problem
The scaling down of semiconductor devices poses challenges in achieving improved quality, yield, performance, and reliability while reducing complexity, particularly in the thinning process where conventional carriers obscure device performance analysis.
Innovation Solution
A multi-stacking carrier structure is introduced, comprising multiple tiers of passivation and insulating layers with vias, which serves as a temporary carrier during substrate thinning, eliminating the need for additional carriers and providing an electrical path for performance analysis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional carriers are used during substrate thinning, then the substrate can be supported during processing, but the carriers obscure device performance analysis and require additional removal steps
Solution Approach 1:
The patent introduces a multi-stacking carrier structure as an intermediary element that temporarily supports the substrate during thinning processes. This carrier includes multiple tiers with passivation layers, insulating layers, and vias that provide mechanical support while allowing electrical access to device elements. The carrier is designed to be removed after thinning, having served its intermediary purpose of enabling substrate processing without obscuring device analysis.
Solution Approach 2:
The carrier structure is segmented into multiple tiers (first tier, second tier, third tier), each with specific functions. The segmentation allows different portions of the carrier to serve different purposes: some layers provide mechanical support, others provide electrical isolation, and vias provide electrical access. This segmented design enables the carrier to be removed in a controlled manner after serving its support function during thinning.
2Stability of the object's composition
If additional carriers are used to support the substrate during thinning, then processing stability is improved, but fabrication costs increase
Solution Approach 1:
The multi-stacking carrier structure is designed to perform multiple functions simultaneously: it provides mechanical support during thinning, maintains electrical connections to device elements for monitoring, and offers a structured platform for controlled removal. This multi-functionality reduces the need for additional specialized carriers or tools, thereby reducing overall fabrication costs while maintaining processing stability.
Solution Approach 2:
The carrier structure incorporates vias that extend through multiple tiers, providing self-service electrical access to device elements during the thinning process. This eliminates the need for external probing or additional measurement equipment, reducing fabrication complexity and cost while maintaining stable processing conditions.
3Speed
If the substrate is thinned to improve device performance, then device speed and efficiency are enhanced, but the substrate becomes more fragile and difficult to handle
Solution Approach 1:
The multi-stacking carrier structure is attached to the substrate before the thinning process begins. This preliminary action provides mechanical reinforcement to the substrate throughout the thinning operation, preventing fragility and handling difficulties. The carrier remains in place during thinning, offering continuous support, and can be removed after the substrate achieves its target thickness and improved performance characteristics.
Data Source
AI summary
The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes an inter-dielectric layer on a substrate; a conductive pad in the inter-dielectric layer; and a multi-stacking carrier structure including a first tier on the inter-dielectric layer, a second tier on the first tier, and a third tier on the second tier.