Multi-Stage Alignment for Electronic Component Mounting
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Solution Overview
Problem
Existing methods for mounting electronic components on carrier bodies lack accuracy, leading to potential misalignment and increased tolerance issues during the manufacturing of semiconductor devices.
Innovation Solution
The method involves using a support body with first alignment marks and carrier bodies with second alignment marks, allowing for precise alignment of electronic components on the carrier bodies through multiple alignment procedures, utilizing different sets of alignment marks for rough and fine alignment, and ensuring that the electronic components are accurately positioned relative to the carrier bodies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple alignment procedures are carried out between support body, carrier bodies and electronic components, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The alignment process is segmented into multiple independent alignment procedures: first aligning carrier bodies to the support body using first alignment marks, then aligning electronic components to carrier bodies using second alignment marks. This segmentation allows each alignment step to be optimized independently, achieving high overall precision without requiring a single complex alignment system.
Solution Approach 2:
The support body acts as an intermediary element that provides a stable reference framework for aligning multiple carrier bodies. The first alignment marks on the support body serve as intermediary reference points, enabling accurate positioning of carrier bodies before the final alignment of electronic components. This intermediary structure simplifies the overall alignment complexity by breaking it into manageable stages.
2Manufacturing precision
If different sets of alignment marks are used for rough and fine alignment, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
Different sets of alignment marks with different properties are used for different alignment stages: first alignment marks on the support body are optimized for rough alignment of carrier bodies, while second alignment marks on carrier bodies are optimized for fine alignment of electronic components. This local optimization of alignment mark characteristics for specific purposes achieves high precision without requiring a single complex universal alignment system.
3Reliability
If multiple alignment procedures are implemented, then reliability of mounted components is improved, but loss of time increases
Solution Approach 1:
The support body is pre-equipped with first alignment marks before carrier bodies are mounted, and carrier bodies are pre-marked with second alignment marks. This preliminary preparation of alignment references enables rapid alignment during assembly without requiring time-consuming measurements or adjustments during the mounting process itself, thus maintaining high reliability while minimizing time loss.
Data Source
AI summary
A method of mounting electronic components on one or more carrier bodies is disclosed. The method comprises providing a support body with at least one first alignment mark, mounting the one or more carrier bodies, each having at least one second alignment mark, on the support body by alignment between the at least one first alignment mark and the at least one second alignment mark. Thereafter, the method includes mounting the plurality of electronic components on a respective one of the one or more carrier bodies by alignment using the at least one second alignment mark.