Multi-Stage Heater Structure for Uniform Thin Film Deposition
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing thin film deposition apparatuses with multiple-stage heaters face issues of unstable substrate support, temperature interference between heaters, and non-uniform temperature distribution, leading to reduced productivity and deposition quality.
Innovation Solution
A thin film deposition apparatus with a stable substrate support structure that includes heat shield plates and individually controlled heaters, using ceramic materials to minimize heat transfer and temperature uniformity, and a driver for elevating and rotating the heaters, along with temperature sensors for precise control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple-stage heaters are used to process multiple substrates simultaneously, then productivity is improved, but temperature uniformity deteriorates due to heat interference between heaters
Solution Approach 1:
Heat shield plates are introduced as intermediary components between adjacent heaters to block thermal interference. These plates prevent heat from one heater from directly affecting adjacent heaters, thereby maintaining temperature uniformity while enabling simultaneous processing of multiple substrates on different stages.
Solution Approach 2:
The heating system is segmented into independently controllable heater stages, each with its own temperature control. This allows individual temperature adjustment for each stage, compensating for heat interference and maintaining uniform temperature distribution across all substrates being processed simultaneously.
2Productivity
If heaters are arranged in vertical multi-stage configuration, then productivity is improved, but structural stability deteriorates due to support requirements
Solution Approach 1:
The stage structure is designed to serve multiple functions: it supports substrates, provides mounting for heaters, incorporates heat shield plates, and includes cable routing channels. This multi-functional design reduces the number of separate components needed, simplifying the overall support structure while maintaining vertical multi-stage configuration for high productivity.
3Manufacturing precision
If individual heater control is implemented, then temperature uniformity is improved, but device complexity increases
Solution Approach 1:
Multiple cable connections for individual heater control are merged into a single integrated cable routing channel on the stage structure. This consolidates the control system infrastructure, reducing spatial complexity and simplifying installation while maintaining independent temperature control capability for each heater stage.
4Reliability
If lift pins elevate through heaters, then substrate support is improved, but heat transfer to lift pins increases causing unwanted heating
Solution Approach 1:
Heat shield plates are positioned to act as thermal barriers between the heaters and the lift pins. These plates block direct heat transfer to the lift pins while allowing the pins to freely elevate and support substrates, thereby maintaining substrate support reliability without causing unwanted heating of the lift pins.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves stable substrate support and temperature uniformity across multiple layers, enhancing deposition quality and productivity by minimizing thermal interference and ensuring uniform heating.
Implementation Method 1
a plurality of heat shield plates, having a heat shield function between the heater members
Implementation Method 2
a plurality of heater members disposed to correspond to the substrates to heat the substrates, respectively
Data Source
AI summary
A thin film deposition apparatus includes: a chamber configured to process a plurality of substrates; a plurality of heater members disposed to correspond to the substrates to heat the substrates, respectively; a plurality of lift pins configured to support lower surfaces of the substrates while elevating through the heater members, respectively; a plurality of heat shield plates, having a heat shield function between the heater members, on which lower ends of the lift pins are configured to be seated; and a plurality of support columns coupled with and supporting the heater members.