Multi-stage Showerhead for Uniform Thin Film Deposition

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Solution Overview

Problem

Capacitive-coupled parallel plate plasma enhanced chemical vapor deposition reactors face challenges in achieving uniform layer deposition due to asymmetrical gas distribution and emission profiles, leading to non-uniform thickness and quality of deposited films.

Innovation Solution

A multi-stage showerhead gas distribution unit integrated into the RF electrode, allowing independent adjustment of gas distribution and emission profiles, with separate gas buffer volumes between holes to ensure uniform gas flow and distribution, reducing unwanted intermixing and enhancing layer homogeneity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a conventional gas distribution system with single-stage showerhead is used, then the device complexity is low, but the layer deposition uniformity deteriorates due to asymmetrical gas distribution and emission profiles

Engineering Contradiction:
Improvelayer deposition uniformityVSAvoidgas distribution system complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The gas distribution system is divided into multiple stages with separate gas distribution plates and emission plates. Each plate has specifically designed hole patterns that work together to achieve uniform gas distribution and symmetric emission profiles, resolving the contradiction between system complexity and deposition uniformity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the gas distribution system have locally optimized characteristics. The first gas distribution plate has holes with specific dimensions and patterns, while the second plate has different hole configurations. This local optimization ensures uniform gas flow distribution across the substrate surface, achieving high deposition uniformity.

Inventive Principle:
Principle #3Local quality

2Productivity

If the electrode distance is reduced to decrease gas buffer volume, then the productivity increases with faster equilibrium adjustment, but the manufacturing precision deteriorates due to reduced control over gas distribution

Engineering Contradiction:
Improvedeposition rateVSAvoidlayer thickness uniformity
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The multi-stage showerhead design pre-distributes gas uniformly across the reaction chamber before plasma ignition. The separate distribution and emission plates create optimized flow patterns that maintain layer thickness uniformity even at reduced electrode distances, enabling both high productivity and manufacturing precision.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system changes the gas distribution parameters through multiple plates with varying hole sizes and patterns. This allows optimization of gas flow characteristics to maintain uniform deposition even when the electrode distance is reduced for higher productivity.

Inventive Principle:
Principle #35Parameter changes

3Loss of time

If a compact parallel plate reactor design is used, then the loss of time is reduced with faster plasma equilibrium adjustment, but the area of the reactor is reduced limiting gas distribution control

Engineering Contradiction:
Improvetime to plasma equilibriumVSAvoidreactor chamber area
Core Design Contradiction:
Loss of timeVSArea of stationary object

Solution Approach 1:

The gas distribution system utilizes the vertical dimension with multiple stacked plates (distribution plates and emission plates) rather than relying solely on horizontal area. This multi-layer approach enables effective gas distribution control in a compact volume, achieving fast equilibrium adjustment while maintaining distribution precision.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves highly uniform layer deposition by optimizing gas flow and pressure distribution, reducing layer thickness variance and improving the homogeneity of deposited films, especially for thin films, while minimizing the footprint of the reactor and reducing gas precursor consumption.

Implementation Method 1

An asymmetric RF voltage is used to provide a plasma generated in the parallel plate arrangement with electrical power. The RF voltage is provided by an RF generator. Typically, the used plasma excitation frequencies are in a region between 13 MHz to about 80 MHz.

Methodology Applied
Scientific EffectRF plasma generation: Plasma

Implementation Method 2

the gas distribution unit comprises at least one first gas distribution plate and at least one second gas distribution plate which is spaced from the first gas distribution plate in the direction of the gas flow through the reactor

Methodology Applied
Scientific EffectGas flow distribution:

Data Source

PatentUS9224581B2Parallel plate reactor for uniform thin film deposition with reduced tool foot-print
Publication Date: 2015.12.29 MEYER BURGER (GERMANY) GMBH
  • US9224581B2 patent drawing
  • US9224581B2 patent drawing
  • US9224581B2 patent drawing

AI summary

A capacitive-coupled parallel plate plasma enhanced chemical vapor deposition reactor includes a gas distribution unit that is integrated in an RF electrode and is formed with a gas outlet. The parallel plate reactor is configured so that layers with high thickness homogeneity and quality can be produced. The capacitively coupled parallel plate plasma enhanced vapor deposition reactor has gas distribution unit with a multiple-stage showerhead constructed in such a way that it provides an independent adjustment of gas distribution and gas emission profile of the gas distribution unit.