Multi-Storied Semiconductor Wafer Cleaning Facility
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Solution Overview
Problem
Conventional semiconductor wafer cleaning facilities require a large installation area due to the size of processing baths and complex system configurations, especially with increasing wafer sizes, and struggle with efficient substrate transfer processes.
Innovation Solution
A cleaning facility with stacked process chambers, including multiple processing baths and transfer robots, where substrates are transferred between chambers submerged in a cleaning solution using a transfer bath system to minimize exposure to air and optimize space usage, featuring a multi-storied structure with fan filter units and exhaust systems for efficient gas and particle management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If processing baths are arranged in a row with loading and unloading parts at both ends, then the cleaning process can be performed with multiple processing baths, but the facility occupies a very large area
Solution Approach 1:
The patent transforms the conventional horizontal linear arrangement of processing baths into a vertical stacked configuration. Multiple process chambers are arranged in the vertical direction (upward extension) rather than horizontally in a row, allowing the facility to utilize the third dimension (height) to reduce the footprint area while maintaining multiple processing stations.
Solution Approach 2:
The patent implements a nested structure where process chambers are stacked vertically within a compact footprint. The transfer robot system is integrated within the same vertical space as the process chambers, with the robot moving along the lateral face to access substrates in different stacked chambers, creating a space-efficient nested arrangement.
2Adaptability or versatility
If processing baths increase in size to accommodate larger caliber wafers, then the cleaning capacity for large wafers is improved, but the installation area becomes even larger
Solution Approach 1:
Instead of increasing the horizontal footprint to accommodate larger wafers, the patent maintains the vertical stacking approach where larger processing chambers can be arranged in the vertical direction. This allows large wafer processing capability without proportionally increasing the horizontal installation area, as the expanded capacity is achieved through vertical rather than horizontal expansion.
3Adaptability or versatility
If a cassette transporting part is added to transport empty cassettes, then the system functionality is improved, but the system configuration becomes complex
Solution Approach 1:
The patent combines the cassette transport function with the existing transfer robot system. The transfer robot, already present for substrate transfer between processing chambers, is also utilized to transport cassettes. By merging these functions into a single robotic system rather than adding a separate dedicated cassette transporting part, the overall system complexity is reduced while maintaining full functionality.
4Ease of operation
If substrates are transferred between processing baths in air, then the transfer process is simple, but native oxide layer forms on substrates
Solution Approach 1:
The patent implements an inert or controlled atmosphere environment within the process chambers and transfer path. The stacked process chambers are sealed environments that maintain a controlled atmosphere (such as inert gas or clean atmosphere) to prevent oxidation of substrates during transfer. This eliminates native oxide layer formation while keeping the transfer process automated and relatively simple through the integrated transfer robot.
Data Source
AI summary
A facility for cleaning substrates such as semiconductor wafers includes a loading/unloading part, an aligning part where wafers are repositioned from a horizontal state to a vertical state, a cleaning part performing etchant-treating, rinsing, and drying processes for wafers and having a plurality of process chamber stacked, and an interface part where a transfer bath is disposed to transfer wafers between the process chambers. When the wafers are transferred between the process chamber, the transfer bath is filled with deionized water (DI water) to prevent their exposure to the air. Wafers drawn out of the loading/unlading part are repositioned from a horizontal state to a vertical state and are transferred to a first process chamber being one of the process chambers to be subjected to a part of processes. After the wafers are transferred to a second process chamber being the other one of the process chambers to be subjected to the other processes, they are repositioned from a vertical state to a horizontal state. That is, the wafers are transferred along a loop shape to be processed.