Multi-Strain Gauge Sensor for MEMS Thermal Management
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Solution Overview
Problem
Conventional strain gauge designs for MEMS devices do not fully utilize the surface area of deformable substrates, are difficult to miniaturize, and are unsuitable for plastic materials due to poor thermal dissipation, limiting their performance and applicability in small-scale and temperature-sensitive applications.
Innovation Solution
The use of sensor devices with a deformable substrate featuring a combination of radial and tangential strain gauge elements arranged on both sides, connected via electrically conducting vias to form bridge circuitries, which maximize measurement range and performance by experiencing opposite strain directions, and an enclosure pattern to prevent misalignment and enhance thermal dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional strain gauge designs are used, then the sensor can be manufactured with simple structures, but the surface area of the deformable substrate is not fully utilized and miniaturization is difficult
Solution Approach 1:
The patent transitions from conventional two-dimensional strain gauge arrangements to a three-dimensional configuration by placing strain gauges on both sides of the deformable substrate. This allows full utilization of the substrate surface area while enabling miniaturization through vertical stacking of sensing elements.
Solution Approach 2:
The patent combines multiple strain gauge elements (radial and tangential types) into an integrated sensor device that forms a complete Wheatstone bridge circuit. This merging of multiple sensing functions into a single compact device resolves the contradiction between size reduction and functional completeness.
2Temperature
If conventional strain gauge designs are used, then manufacturing is simpler, but thermal dissipation is poor especially on plastic substrates
Solution Approach 1:
The patent introduces a heat dissipation layer as an intermediary component between the strain gauges and the plastic substrate. This dedicated thermal management layer improves heat dissipation from the sensor elements without complicating the overall manufacturing process, as it can be applied as a separate step.
3Measurement precision
If strain gauges are arranged to maximize measurement range, then sensitivity is improved, but misalignment errors increase
Solution Approach 1:
The patent designs the sensor device with symmetric radial and tangential strain gauge arrangements that create balanced measurement conditions. This equipotential design ensures that all strain gauge elements experience comparable environmental conditions and stress distributions, reducing misalignment errors and improving measurement accuracy.
4Measurement precision
If a full Wheatstone bridge configuration is implemented, then measurement performance is improved, but device complexity increases
Solution Approach 1:
The patent merges the Wheatstone bridge circuitry directly into the sensor device structure by integrating all four bridge arms using strain gauges on both sides of the substrate. This consolidation eliminates the need for external resistors and complex wiring, achieving full bridge functionality in a compact integrated form factor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances sensitivity, temperature stability, repeatability, and linearity, allowing for improved strain measurement capabilities and broader applicability, including on plastic substrates, while preventing misalignment errors and improving thermal management.
Implementation Method 1
its metallic pattern is deformed in response to deformations of the object to which it is attached, thereby causing a respective change in at least one electrical property (e.g., resistance) of the sensor
Implementation Method 2
an enclosure pattern to prevent misalignment and enhance thermal dissipation
Data Source
AI summary
A sensor device including a deformable substrate and a plurality of sensing elements formed on or in the deformable substrate, each of the plurality of sensing elements including at least one of a plurality of strain sensitive lines radially extending with respect to a center of the sensor device and a plurality of strain sensitive lines extending along a circular section with respect to the center of the sensor device, and one or more electrically conducting vias formed in the deformable substrate for electrically connecting between one or more of the sensing elements formed on the first side of the deformable substrate and one or more of the sensing elements formed on the second side of the deformable substrate.